SRAM Module, 1MX32, 17ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | White Electronic Designs Corporation |
| 包装说明 | 28 MM, CERAMIC, QFP-84 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 17 ns |
| 其他特性 | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 |
| JESD-30 代码 | R-CQFP-G84 |
| JESD-609代码 | e0 |
| 长度 | 27.18 mm |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 84 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1MX32 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFP |
| 封装等效代码 | QFP84,1.2SQ,50 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大待机电流 | 0.065 A |
| 最小待机电流 | 3 V |
| 最大压摆率 | 0.6 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 27.18 mm |
| Base Number Matches | 1 |
| WS1M32V-17G3M | WS1M32V-25G3MA | WS1M32V-17G3IA | WS1M32V-20G3IA | WS1M32V-20G3MA | |
|---|---|---|---|---|---|
| 描述 | SRAM Module, 1MX32, 17ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84 | SRAM Module, 1MX32, 25ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84 | SRAM Module, 1MX32, 17ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84 | SRAM Module, 1MX32, 20ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84 | SRAM Module, 1MX32, 20ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | 28 MM, CERAMIC, QFP-84 | 28 MM, CERAMIC, QFP-84 | 28 MM, CERAMIC, QFP-84 | 28 MM, CERAMIC, QFP-84 | 28 MM, CERAMIC, QFP-84 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 17 ns | 25 ns | 17 ns | 20 ns | 20 ns |
| 其他特性 | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 | USER CONFIGURABLE AS 2M X 16 OR 4M X 8 |
| JESD-30 代码 | R-CQFP-G84 | R-CQFP-G84 | R-CQFP-G84 | R-CQFP-G84 | R-CQFP-G84 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 27.18 mm | 27.18 mm | 27.18 mm | 27.18 mm | 27.18 mm |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 84 | 84 | 84 | 84 | 84 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C |
| 组织 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFP | QFP | QFP | QFP | QFP |
| 封装等效代码 | QFP84,1.2SQ,50 | QFP84,1.2SQ,50 | QFP84,1.2SQ,50 | QFP84,1.2SQ,50 | QFP84,1.2SQ,50 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大待机电流 | 0.065 A | 0.065 A | 0.065 A | 0.065 A | 0.065 A |
| 最小待机电流 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 最大压摆率 | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 27.18 mm | 27.18 mm | 27.18 mm | 27.18 mm | 27.18 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | White Electronic Designs Corporation | - | - | White Electronic Designs Corporation | White Electronic Designs Corporation |
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