CLOCK RECOVERY CIRCUIT, PDSO28
时钟恢复电路, PDSO28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, SOIC-28 |
| 针数 | 28 |
| Reach Compliance Code | _compli |
| SY87700LZI | SY87700L_06 | SY87700LZITR | SY87700LZGTR | SY87700LHITR | SY87700LHGTR | SY87700LHI | |
|---|---|---|---|---|---|---|---|
| 描述 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PQFP32 | CLOCK RECOVERY CIRCUIT, PDSO28 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 零件包装代码 | SOIC | - | SOIC | SOIC | QFP | QFP | QFP |
| 包装说明 | 0.300 INCH, SOIC-28 | - | SOP, SOP28,.4 | SOP, SOP28,.4 | HTQFP, TQFP32,.35SQ,32 | HTQFP, | TQFP-32 |
| 针数 | 28 | - | 28 | 28 | 32 | 32 | 32 |
| Reach Compliance Code | _compli | - | _compli | compli | _compli | compli | _compli |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | - | 28 | 28 | 28 | 32 | 32 | - |
| 表面贴装 | - | Yes | YES | YES | YES | YES | - |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子位置 | - | DUAL | DUAL | DUAL | QUAD | QUAD | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| JESD-30 代码 | - | - | R-PDSO-G28 | R-PDSO-G28 | S-PQFP-G32 | S-PQFP-G32 | - |
| JESD-609代码 | - | - | e0 | e4 | e0 | e4 | - |
| 长度 | - | - | 17.93 mm | 17.93 mm | 7 mm | 7 mm | - |
| 湿度敏感等级 | - | - | 1 | 2 | 3 | 3 | - |
| 最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | - | SOP | SOP | HTQFP | HTQFP | - |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | - |
| 封装形式 | - | - | SMALL OUTLINE | SMALL OUTLINE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | - |
| 峰值回流温度（摄氏度） | - | - | 240 | 260 | 240 | 260 | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | - | 2.65 mm | 2.65 mm | 1.2 mm | 1.2 mm | - |
| 标称供电电压 | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 电信集成电路类型 | - | - | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | - |
| 端子面层 | - | - | Tin/Lead (Sn75Pb25) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子节距 | - | - | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | - |
| 处于峰值回流温度下的最长时间 | - | - | 30 | 40 | 30 | 40 | - |
| 宽度 | - | - | 7.52 mm | 7.52 mm | 7 mm | 7 mm | - |
DigiKey得捷技术专区
嵌入式系统
ADI参考电路
嵌入式系统
PCB设计
模拟与混合信号
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
