4-BIT, FLASH, 4MHz, MICROCONTROLLER, PBGA
参数名称 | 属性值 |
厂商名称 | Seiko Epson Corporation |
零件包装代码 | BGA |
包装说明 | BGA, |
Reach Compliance Code | unknown |
具有ADC | NO |
地址总线宽度 | |
位大小 | 4 |
最大时钟频率 | 4 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | R-PBGA-B |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
ROM可编程性 | FLASH |
速度 | 4 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 2.1 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | BALL |
端子位置 | BOTTOM |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
S1C63158B0A010G | S1C63158B0A010J | S1C63158B0A010N | S1C63158B0A010K | S1C63158B0A010L | S1C63158F0A010A | S1C63158F0A010K | S1C63158D0A010M | |
---|---|---|---|---|---|---|---|---|
描述 | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PBGA | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PBGA | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PBGA | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PBGA | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PBGA | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PQFP60, PLASTIC, QFP-60 | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, PQFP60, PLASTIC, QFP-60 | 4-BIT, FLASH, 4MHz, MICROCONTROLLER, UUC53, DIE-53 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | QFP | QFP | DIE |
包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | QFP, | QFP, | DIE, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
位大小 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
最大时钟频率 | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PBGA-B | R-PBGA-B | R-PBGA-B | R-PBGA-B | R-PBGA-B | S-PQFP-G60 | S-PQFP-G60 | X-XUUC-N53 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | BGA | BGA | BGA | BGA | BGA | QFP | QFP | DIE |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | UNSPECIFIED |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | UNCASED CHIP |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
速度 | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 2.1 V | 2.1 V | 2.1 V | 2.1 V | 2.1 V | 2.1 V | 2.1 V | 2.1 V |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | GULL WING | GULL WING | NO LEAD |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD | UPPER |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
厂商名称 | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | - | Seiko Epson Corporation | Seiko Epson Corporation |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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