IDT71B221S24PF概述

Cache SRAM, 8KX18, BICMOS, PQFP52, PLASTIC, QFP-52

IDT71B221S24PF规格参数

参数名称	属性值
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFP
包装说明	QFP,
针数	52
Reach Compliance Code	unknown
ECCN代码	EAR99
JESD-30 代码	S-PQFP-G52
JESD-609代码	e0
内存密度	147456 bit
内存集成电路类型	CACHE SRAM
内存宽度	18
功能数量	1
端口数量	1
端子数量	52
字数	8192 words
字数代码	8000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	8KX18
输出特性	3-STATE
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	QFP
封装形状	SQUARE
封装形式	FLATPACK
并行/串行	PARALLEL
认证状态	Not Qualified
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	BICMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	GULL WING
端子位置	QUAD
Base Number Matches	1

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IDT71B221S24PF相似产品对比

	IDT71B221S24PF	IDT71B221S24J	IDT71B221S28JB8	IDT71B221S28PF	IDT71B221S28J	IDT71B221S28JB	IDT71B221S28J8	IDT71B221S24J8
描述	Cache SRAM, 8KX18, BICMOS, PQFP52, PLASTIC, QFP-52	Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 8KX18, BICMOS, PQFP52, PLASTIC, QFP-52	Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	QFP	LCC	LCC	QFP	LCC	LCC	LCC	LCC
包装说明	QFP,	QCCJ,	QCCJ,	QFP,	QCCJ,	QCCJ,	QCCJ,	QCCJ,
针数	52	52	52	52	52	52	52	52
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	3A001.A.2.C	EAR99	EAR99	3A001.A.2.C	EAR99	EAR99
JESD-30 代码	S-PQFP-G52	S-PQCC-J52	S-PQCC-J52	S-PQFP-G52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	18	18	18	18	18	18	18	18
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	52	52	52	52	52	52	52	52
字数	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
字数代码	8000	8000	8000	8000	8000	8000	8000	8000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	125 °C	70 °C	70 °C	125 °C	70 °C	70 °C
组织	8KX18	8KX18	8KX18	8KX18	8KX18	8KX18	8KX18	8KX18
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QFP	QCCJ	QCCJ	QFP	QCCJ	QCCJ	QCCJ	QCCJ
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK	CHIP CARRIER	CHIP CARRIER	FLATPACK	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
温度等级	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	GULL WING	J BEND	J BEND	GULL WING	J BEND	J BEND	J BEND	J BEND
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Base Number Matches	1	1	1	1	1	1	1	1
长度	-	19.1262 mm	19.1262 mm	-	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm
座面最大高度	-	4.57 mm	4.57 mm	-	4.57 mm	4.57 mm	4.57 mm	4.57 mm
端子节距	-	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm
宽度	-	19.1262 mm	19.1262 mm	-	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm

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