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2299805-1概述

NRW BACK PLATE ASSY,SOCKET P0,STUD6.8MM

	2299805-1	GUB-GL8A-03-2231-B-C	2299804-3	2299806-1	2299804-1	2-2129710-8	2-2822979-4
描述	NRW BACK PLATE ASSY,SOCKET P0,STUD6.8MM	Array/Network Resistor, Isolated, Thin Film, 0.16W, 2230ohm, 0.1% +/-Tol, -25,25ppm/Cel, 4430,	NRW NON-FABRIC BOLSTER,P0, W/O COVER	NRW NON-FABRIC CARRIER, SOCKET P0	NRW NON-FABRIC BOLSTER,P0,W/ COVER	RIGHT SIDE LGA3647-1 SOCKET-P1 FOR ODM	LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU)
附件类型	背板	-	Bolster Assembly	Carrier	Bolster Assembly	-	-
插座类型	LGA 3647	-	LGA 3647	LGA 3647	LGA 3647	LGA 3647	LGA 3647
工组温度范围	-25 – 100 °C [ -13 – 212 °F ]	-	-25 – 100 °C [ -13 – 212 °F ]	-25 – 100 °C [ -13 – 212 °F ]	-25 – 100 °C [ -13 – 212 °F ]	-25 – 100 °C [ -13 – 212 °F ]	-25 – 100 °C [ -13 – 212 °F ]
封装方法	盒和托盘	-	盒和托盘	Box & Tray	盒和托盘	托盘	托盘
注释	Backplate Assembly	-	窄型，不带盖。	-	窄型，带盖。	无铅焊球	无铅焊球

器件捷径: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

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