RoHS Compliant
SURMOUNT
TM
PIN Diodes
Features
♦
♦
♦
♦
♦
♦
♦
Surface Mount Devices
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
MADP-042305-13060 MADP-042505-13060
MADP-042405-13060 MADP-042905-13060
MADP-042XX5-13060 Series
V. 3
Description
This device is a Silicon-Glass PIN diode chip fabricated with
M/A-COM’s patented HMIC
TM
process. This device features two
silicon pedestals embedded in a low loss, low dispersion glass.
The diode is formed on the top of one pedestal and connections
to the backside of the device are facilitated by making the
pedestal sidewalls electrically conductive. Selective backside
metallization is applied producing a surface mount device. This
vertical topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection. These
protective coatings prevent damage to the junction and the anode
air-bridge during handling and assembly.
G
D
E
F
Bottom Side Contacts are Circuit Side
Applications
These packageless devices are suitable for usage in moderate
incident power (10W C.W.) and 50 W, 1 µS, 0.01% duty cycle,
peak power, series, shunt, or series-shunt switches. Smaller
parasitic inductance, 0.4 nH, and excellent RC constant, make the
devices ideal for higher frequency switch elements compared to
their plastic device counterparts.
DIM
INCHES
min
A
B
C
D
E
F
G
0.040
0.021
0.004
0.013
0.011
0.013
0.019
max
0.042
0.023
0.008
0.015
0.013
0.015
0.021
min
1.025
0.525
0.102
0.325
0.275
0.325
0.475
MM
max
1.075
0.575
0.203
0.375
0.325
0.375
0.525
Absolute Maximum Ratings
@ T
A
= +25°C ( unless otherwise specified )
Parameter
MADP-042…-13060
C.W. Incident Power
dBm
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
Absolute Maximum
305
405
505
905
40
44
43
35
250 mA
| - 80 V |
-55
°C
to +125
°C
-55
°C
to +150
°C
+175
°C
+235
°C
for 10 seconds
Notes:
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate
backside ohmic gold contacts.
3. All devices have the same outline
dimensions ( A to G).
M/A-COM
Inc. and its affiliates reserve the right to make changes to
the products or information contained herein without notice.
M/A-COM
makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does
M/A-COM
assume any liability whatsoever arising out of the use or application of
any products or information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit :
www.macom.com
for additional data sheets and product information.
RoHS Compliant
SURMOUNT
TM
PIN Diodes
MADP-042305-13060 MADP-042505-13060
MADP-042405-13060 MADP-042905-13060
MADP-042XX5-13060 Series
V. 3
Electrical Specifications @ + 25 °C
Min
Parameter
Symbol
Conditions
Units
MADP-042305-13060
Typ
Max
Min
Typ
Max
MADP-042505-13060
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Forward Voltage
Reverse Leakage
Current
Input Third Order
Intercept Point
C.W. Thermal
Resistance
Lifetime
C
T
C
T
C
T
C
T
R
S
R
S
V
F
I
R
- 10 V, 1 MHz
1
- 10 V, 1 GHz
1,3
- 40 V, 1 MHz
1
- 40 V, 1 GHz
1,3
+ 20 mA, 1 GHz
2,3
+ 50 mA, 1 GHz
2,3
+ 10 mA
| -80V |
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
I
H
=0.5A, I
L
=10 mA
+10 mA / -6 mA
( 50 % - 90 % V )
pF
pF
pF
pF
Ω
Ω
V
uA
0.14
0.15
0.13
0.14
1.32
1.18
0.87
0.22
0.22
1.00
10
0.28
0.28
0.27
0.27
0.83
0.76
0.84
0.40
0.40
1.00
10
IIP3
dBm
°
C/W
nS
Min
72
76
R
θJL
T
L
145
180
Typ
Max
Min
115
210
Typ
Max
Parameter
Symbol
Conditions
Units
MADP-042405-13060
MADP-042905-13060
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Forward Voltage
Reverse Leakage
Current
Input Third Order
Intercept Point
C.W. Thermal
Resistance
Lifetime
1.
2.
3.
4.
C
T
C
T
C
T
C
T
R
S
R
S
V
F
I
R
- 10 V, 1 MHz
1
- 10 V, 1 GHz
1,3
- 40 V, 1 MHz
1
- 40 V, 1 GHz
1,3
+ 20 mA, 1 GHz
2,3
+ 50 mA, 1 GHz
2,3
+ 10 mA
| -80V |
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
I
H
=0.5A, I
L
=10 mA
+10 mA / -6 mA
( 50 % - 90 % V )
pF
pF
pF
pF
Ω
Ω
V
uA
0.61
0.61
0.57
0.58
0.62
0.58
0.82
0.75
0.75
1.00
10
0.06
0.06
0.06
0.06
3.14
2.60
0.93
0.18
0.18
1.00
10
IIP3
dBm
°
C/W
nS
80
65
R
θJL
T
L
100
255
185
140
Total capacitance, C
T
, is equivalent to the sum of junction capacitance ,C
j
, and parasitic capacitance, C
par
.
Series resistance R
S
is equivalent to the total diode resistance : R
s
= R
j
( Junction Resistance) + R
c
( Ohmic Resistance)
R
s
and C
T
are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package with Sn 60/Pb 40 solder
Steady-state R
θJL
measured with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder.
Specifications Subject to Change Without Notice
.
M/A-COM
Inc. and its affiliates reserve the right to make changes to
the products or information contained herein without notice.
M/A-COM
makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does
M/A-COM
assume any liability whatsoever arising out of the use or application of
any products or information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit :
www.macom.com
for additional data sheets and product information.
RoHS Compliant
SURMOUNT
TM
PIN Diodes
MADP-042305-13060 MADP-042505-13060
MADP-042405-13060 MADP-042905-13060
MADP-042XX5-13060 Series
V. 3
MADP-042005 Series Typical Performance Curves @ +25 °C
Ct @ 1GHz
0.800
0.700
0.600
0.500
Ct (pF)
0.400
0.300
0.200
0.100
0.000
0
5
10
15
20
Bias (V)
25
30
35
40
042505
042305
042905
042405
Ct vs V
10.000
Rs @ 1GHz
Rs vs I
042905
042305
1.000
042505
042405
Rs (ohm)
0.100
0.001
0.010
Bias (A)
0.100
Ct @ 10V
0.700
042405
0.600
0.500
Ct (pF)
Ct vs F
0.700
Ct @ 40V
Ct vs F
042405
0.600
0.500
Ct (pF)
0.400
0.300
0.200
0.100
042505
0.400
0.300
0.200
0.100
042905
0.000
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
042505
042305
042305
042905
0.000
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
Rs @ 10mA
4.50E+00
4.00E+00
3.50E+00
3.00E+00
Rs (ohm)
2.50E+00
2.00E+00
1.50E+00
042505
1.00E+00
5.00E-01
0.00E+00
042405
042305
042905
Rs vs F
4.00E+00
3.50E+00
3.00E+00
Rs (ohm)
2.50E+00
2.00E+00
1.50E+00
1.00E+00
5.00E-01
0.00E+00
Rs @ 20mA
Rs vs F
042905
042305
042505
042405
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
M/A-COM
Inc. and its affiliates reserve the right to make changes to
the products or information contained herein without notice.
M/A-COM
makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does
M/A-COM
assume any liability whatsoever arising out of the use or application of
any products or information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit :
www.macom.com
for additional data sheets and product information.
RoHS Compliant
SURMOUNT
TM
PIN Diodes
MADP-042305-13060 MADP-042505-13060
MADP-042405-13060 MADP-042905-13060
MADP-042XX5-13060 Series
V. 3
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils.
The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling
should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn @ ~ + 280 °C or Sn 60 / Pb 40
@ ~ + 185 °C solder is recommended. Conductive silver epoxy for die attachment ~ + 150 °C may also be used for lower
Incident power ( < 1 W Average Power ) applications.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip
and force of 60 to100 grams applied to the top surface of the device. When soldering to soft substrates, it is recommended
to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the
circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to
100 grams of force perpendicular to the top surface of the die. The solder joint must
not
be made one at a time, creating
unequal heat flow and thermal stress. Solder reflow should
not
be performed by causing heat to flow through the top
surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be
visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn 60/ Pb 40 and RoHS compliant solders is provided in
Application Note M538
, “Surface
Mounting Instructions“ and can viewed on the MA-COM website @
www.macom.com
Ordering Information
The MADP-042XX5-13060 series of SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in
Application Note M513
located on the
M/A-COM website @
www.macom.com.
Part Number
Gel Pack
MADP-042305-13060G
MADP-042405-13060G
MADP-042505-13060G
MADP-042905-13060G
Tape and Reel
Surf Tape
MADP-042305-13060T
MADP-042405-13060T
MADP-042505-13060T
MADP-042905-13060T
Tape and Reel
Pocket Tape
MADP-042305-13060P
MADP-042405-13060P
MADP-042505-13060P
MADP-042905-13060P
M/A-COM
Inc. and its affiliates reserve the right to make changes to
the products or information contained herein without notice.
M/A-COM
makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does
M/A-COM
assume any liability whatsoever arising out of the use or application of
any products or information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit :
www.macom.com
for additional data sheets and product information.
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