Audio Amplifiers
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| 商用集成电路类型 | VOLUME CONTROL CIRCUIT |
| JESD-30 代码 | S-XQCC-N28 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC28,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大压摆率 | 29 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| MAX9750BETI-T | MAX9750AETI- | MAX9755ETI-T | MAX9750BETI- | MAX9755ETI- | MAX9750BETI | MAX9751ETI-T | MAX9750AETI-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Audio Amplifiers | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFN | - | QFN | - | - | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC28,.2SQ,20 | - | HVQCCN, LCC28,.2SQ,20 | - | - | HVQCCN, LCC28,.2SQ,20 | HVQCCN, LCC28,.2SQ,20 | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 |
| 针数 | 28 | - | 28 | - | - | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | - | not_compliant | - | - | not_compliant | not_compliant | not_compliant |
| 商用集成电路类型 | VOLUME CONTROL CIRCUIT | - | AUDIO AMPLIFIER | - | - | VOLUME CONTROL CIRCUIT | AUDIO AMPLIFIER | VOLUME CONTROL CIRCUIT |
| JESD-30 代码 | S-XQCC-N28 | - | S-XQCC-N28 | - | - | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 |
| JESD-609代码 | e0 | - | e0 | - | - | e0 | e0 | e0 |
| 长度 | 5 mm | - | 5 mm | - | - | 5 mm | 5 mm | 5 mm |
| 功能数量 | 1 | - | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 28 | - | 28 | - | - | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | - | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | - | HVQCCN | - | - | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | - | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 | - | 245 | - | - | 240 | NOT SPECIFIED | 245 |
| 认证状态 | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | - | YES | - | - | YES | YES | YES |
| 技术 | BICMOS | - | BICMOS | - | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | - | NO LEAD | - | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | - | - | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5 mm | - | 5 mm | - | - | 5 mm | 5 mm | 5 mm |
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