Audio Amplifiers Integrated Circuits (ICs)
参数名称 | 属性值 |
产品种类 Product Category | Audio Amplifiers |
制造商 Manufacturer | Maxim(美信半导体) |
产品 Product | Audio Amplifiers |
类 Class | Class-AB |
Output Power | 2.6 W |
Audio - Load Impedance | 32 Ohms |
THD plus Noise | 0.02 % |
最大工作温度 Maximum Operating Temperature | + 85 C |
最小工作温度 Minimum Operating Temperature | - 40 C |
Description/Function | Headphone/Speaker |
Dual Supply Voltage | 5 V |
Input Type | Single |
Maximum Dual Supply Voltage | 5.5 V |
Minimum Dual Supply Voltage | 3 V, 4.5 V |
Output Current | 1.7 A |
Output Signal Type | Differential, Single |
输出类型 Output Type | 2-Channel Stereo |
Pd-功率耗散 Pd - Power Dissipation | 1.9 W |
PSRR - Power Supply Rejection Ratio | 90 dB |
Supply Type | Triple |
MAX9750BETI- | MAX9750AETI- | MAX9755ETI-T | MAX9755ETI- | MAX9750BETI | MAX9751ETI-T | MAX9750AETI-T | MAX9750BETI-T | |
---|---|---|---|---|---|---|---|---|
描述 | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers Integrated Circuits (ICs) | Audio Amplifiers |
是否Rohs认证 | - | - | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | - | - | QFN | - | QFN | QFN | QFN | QFN |
包装说明 | - | - | HVQCCN, LCC28,.2SQ,20 | - | HVQCCN, LCC28,.2SQ,20 | HVQCCN, LCC28,.2SQ,20 | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | HVQCCN, LCC28,.2SQ,20 |
针数 | - | - | 28 | - | 28 | 28 | 28 | 28 |
Reach Compliance Code | - | - | not_compliant | - | not_compliant | not_compliant | not_compliant | not_compliant |
商用集成电路类型 | - | - | AUDIO AMPLIFIER | - | VOLUME CONTROL CIRCUIT | AUDIO AMPLIFIER | VOLUME CONTROL CIRCUIT | VOLUME CONTROL CIRCUIT |
JESD-30 代码 | - | - | S-XQCC-N28 | - | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 | S-XQCC-N28 |
JESD-609代码 | - | - | e0 | - | e0 | e0 | e0 | e0 |
长度 | - | - | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm |
功能数量 | - | - | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | - | - | 28 | - | 28 | 28 | 28 | 28 |
最高工作温度 | - | - | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | - | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | - | - | HVQCCN | - | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | - | - | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | - | - | 245 | - | 240 | NOT SPECIFIED | 245 | 240 |
认证状态 | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
最大供电电压 (Vsup) | - | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | - | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | - | - | YES | - | YES | YES | YES | YES |
技术 | - | - | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | - | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | - | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | - | - | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | - | - | QUAD | - | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | - | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm |
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