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MM912H634CM1AER2

产品描述Motor / Motion / Ignition Controllers & Drivers 64KS12 LIN2xLS/HS Isense
产品类别模拟混合信号IC    信号电路   
文件大小4MB,共339页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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MM912H634CM1AER2概述

Motor / Motion / Ignition Controllers & Drivers 64KS12 LIN2xLS/HS Isense

MM912H634CM1AER2规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码QFP
包装说明7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, MS-026BBC, LQFP-48
针数48
Reach Compliance Codeunknown
ECCN代码3A991.A.2
模拟集成电路 - 其他类型ANALOG CIRCUIT
JESD-30 代码S-PQFP-G48
JESD-609代码e3
长度7 mm
湿度敏感等级3
功能数量1
端子数量48
最高工作温度105 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HLFQFP
封装形状SQUARE
封装形式FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)27 V
最小供电电压 (Vsup)5.5 V
表面贴装YES
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间40
宽度7 mm

文档预览

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Freescale Semiconductor
Technical Data
Document Number: MM912_634D1
Rev. 13.0, 6/2015
Integrated S12 Based Relay
Driver with LIN
The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated,
single package solutions which integrate an HCS12 microcontroller with
a SMARTMOS analog control IC. The Die to Die Interface (D2D)
controlled analog die combines system base chip and application
specific functions, including a LIN transceiver.
Features
16-Bit S12 CPU, 64/48 kByte P-FLASH
6.0 kByte RAM; 4/2 kByte D-FLASH
Background debug (BDM) & debug module (DBG)
Die to Die bus interface for transparent memory mapping
On-chip oscillator & two independent watchdogs
LIN 2.1 Physical layer interface with integrated SCI
10 digital MCU GPIOs shared with SPI (PA7…0, PE1…0)
10-Bit, 15 Channel - Analog to Digital converter (ADC)
16-Bit, 4 Channel - Timer module (TIM16B4C)
8-Bit, 2 Channel - Pulse width modulation module (PWM)
Six high-voltage / Wake-up inputs (L5…0)
Three low voltage GPIOs (PB2…0)
Low power modes with cyclic sense & forced wake-up
Current sense module with selectable gain
Reverse battery protected voltage sense module
Two protected low-side outputs to drive inductive loads
Two protected high-side outputs
Chip temperature sensor
Hall sensor supply & integrated voltage regulator(s)
912_634
AE SUFFIX (PB-FREE)
98ASA00173D
48 PIN LQFP-EP
(7.0 X7.0 mm)
AP SUFFIX (PB-FREE)
98ASH00962A
48 PIN LQFP
(7.0 X7.0 mm)
Battery Sense
Power Supply
LIN Interface
ADC Supply
2.5 V Supply
5.0 V Supply
Digital Ground
Reset
VSENSE
VS1
MM912_634
VS2
LS1
5.0 V Digital I/O
Debug and External
Oscillator
MCU Test
PGND
LIN
LGND
LS2
ADC25
AGND
ISENSEH*
VDD
ISENSEL*
VDDD2D
HSUP
VDDX
VDDRX
DGND
VSSD2D
PTB0/AD0/RX/TIM0CH0
VSSRX
PTB1/AD1/TX/TIM0CH1
RESET PTB2/AD2/PWM/TIM0CH2
RESET_A
HS1
PA0/MISO
PA1/MOSI
HS2*
PA2/SCK
PA3/SS
PA4
L0
PA5
L1
PA6
L2
PA7
L3
BKGD/MODC
L4*
PE0/EXTAL
L5*
PE1/XTAL
TCLK
TEST
TEST_A
* Feature not availablre in all Analog Options
M
Low-side Drivers
Current Sense Mode
Hall Sensor Hall Sensor
Hall Sensor Supply
5.0 V GPI/O with optional
pull-up (shared with ADC,
PWM, Timer, and SCI)
12 V Light/LED and
Switch Supply
Analog/Digital inputs
(High Voltage and Wake-up
capable)
Analog Test
Figure 1. Simplified Application Diagram
© Freescale Semiconductor, Inc., 2010 - 2015. All rights reserved.

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