Encoder, TTL, CDIP20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Monolithic Memories |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | ENCODER |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 571494JB | 571494L883B | 571494L883C | 571494J | 571494JC | 571494J883B | 571494J883C | 571494LB | 571494L | 571494LC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Encoder, TTL, CDIP20, | Encoder, TTL, CQCC20, | Encoder, TTL, CQCC20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CQCC20, | Encoder, TTL, CQCC20, | Encoder, TTL, CQCC20, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T20 | S-XQCC-N20 | S-XQCC-N20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | QCCN | QCCN | DIP | DIP | DIP | DIP | QCCN | QCCN | QCCN |
| 封装等效代码 | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | NO | NO | NO | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 筛选级别 | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | MIL-STD-883 Class C | - | MIL-STD-883 Class C | 38535Q/M;38534H;883B | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class C |
| Objectid | - | 100716891 | 100716893 | 100716888 | 100716887 | 100716884 | 100716886 | 100716892 | 100716895 | 100716894 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
