Encoder, TTL, CQCC20,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Objectid | 100716891 |
Reach Compliance Code | unknown |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e0 |
逻辑集成电路类型 | ENCODER |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
571494L883B | 571494L883C | 571494J | 571494JB | 571494JC | 571494J883B | 571494J883C | 571494LB | 571494L | 571494LC | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Encoder, TTL, CQCC20, | Encoder, TTL, CQCC20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CDIP20, | Encoder, TTL, CQCC20, | Encoder, TTL, CQCC20, | Encoder, TTL, CQCC20, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | S-XQCC-N20 | S-XQCC-N20 | S-XQCC-N20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | QCCN | QCCN | DIP | DIP | DIP | DIP | DIP | QCCN | QCCN | QCCN |
封装等效代码 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ | LCC20,.35SQ |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | NO | NO | NO | NO | NO | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
Objectid | 100716891 | 100716893 | 100716888 | - | 100716887 | 100716884 | 100716886 | 100716892 | 100716895 | 100716894 |
筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 Class C | - | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class C | 38535Q/M;38534H;883B | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class C |
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