Moter Drivers for Printers
Motor Drivers with Brush
for Printers
BD63821EFV, BD63823EFV
No.12010EAT06
●Description
BD63821EFV/BD63823EFV series are built-in 2 channel H-bridge circuits that can drive 2pcs DC brush motor or 1pcs
stepping motor.
These drivers facilitate low power consumption by the direct PWM or PWM constant current control.
●Feature
1) Single power supply input (rated voltage of 36V)
2) Rated output current (peak): 1.0A(1.5A), 2.0A(2.8A)
3) Low ON resistance DMOS output
4) Forward, Reverse, Brake, Open
5) Power save function
6) External PWM control
7) PWM constant current control (current limit function)
8) Built-in spike noise cancel function (external noise filter is unnecessary)
9) Driver for 2 DC brush motor
10) Driver for 1 stepping motor
11) FULL STEP, HALF STEP (driving stepping motor)
12) µSTEP drive by external DAC (driving stepping motor)
13) Built-in logic input pull-down resistor
14) Cross-conduction prevention circuit
15) Signal output of detecting the motor lock state (Wired-OR)
16) Signal output of detecting the abnormal states (Wired-OR)
17) Thermal shutdown circuit (TSD)
18) Over current protection circuit (OCP)
19) Under voltage lock out circuit (UVLO)
20) Over voltage lock out circuit (OVLO)
21) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
22) Electrostatic discharge: 8kV (HBM specification)
23) Adjacent pins short protection
24) Inverted mounting protection
25) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package
26) Pin-compatible line-up
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
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© 2012 ROHM Co., Ltd. All rights reserved.
1/8
2012.02 - Rev.A
BD63821EFV, BD63823EFV
●Absolute
maximum ratings (Ta=25°C)
Item
Symbol
Supply voltage
V
CC1,2
Power dissipation
Input voltage for control pin
RNF maximum voltage
Output current
Output current (peak)
※
4
FAULT, LOCK voltage
FAULT, LOCK current
Operating temperature range
Storage temperature range
Junction temperature
※1
※2
※3
※4
Technical Note
BD63823
-0.3~+36.0
1.45
※
1
4.70
※
2
-0.3~+7.0
0.7
2.0
※
3
2.8
※
3
-0.3~7.0
5
-25~+85
-55~+150
+150
BD63821
Pd
V
IN
V
RNF
I
OUT
I
OUTPEAK
V
FAULT
I
FAULT
T
opr
T
stg
T
jmax
1.0
※
3
1.5
※
3
Unit
V
W
W
V
V
A/ch
A/ch
V
mA
°C
°C
°C
70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.
4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.
Do not, however exceed Pd, ASO and Tjmax=150°C.
Pulse width tw≦20ms
●Operating
conditions (Ta= -25~+85°C)
Item
Symbol
Supply voltage
V
CC1,2
Input voltage for control pin
V
IN
PWM input frequency
F
IN
Min.
19
0
-
Typ.
24
-
-
Max.
28
5.5
100
Unit
V
V
kHz
●Electrical
characteristics (Unless otherwise specified Ta=25°C, V
CC1.2
=24V)
Limit
Item
Symbol
Min.
Typ.
Whole
Circuit current at standby
I
CCST
-
1.0
Circuit current
I
CC
-
2.5
Control input (IN1A, IN1B, IN2A, IN2B, PS)
H level input voltage
V
INH
2.0
-
L level input voltage
V
INL
-
-
H level input current
I
INH
35
50
L level input current
I
INL
-10
0
FAULT LOCK output (FAULT, LOCK)
Output low voltage
V
FAULT
-
50
Output leak current
I
FAULT_LEAK
-
-
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output on resistance (BD63823EFV)
R
ON
-
0.65
Output on resistance (BD63821EFV)
R
ON
1.90
Output leak current
I
LEAK
-
-
Current control
RNFXS input current
I
RNFS
-2.0
-0.1
RNFX input current
I
RNF
-40
-20
VREF input current
I
VREF
-2.0
-0.1
VREF input voltage range
V
REF
0
-
Minimum on time (Blank time)
t
ONMIN
0.7
1.5
Current limit
0.57
0.60
V
CTH
Comparator threshold
Max.
2.5
5.0
-
0.8
100
-
100
10
0.90
2.50
10
-
-
-
3.0
3.0
0.63
Unit
Condition
mA
mA
V
V
µA
µA
mV
µA
Ω
Ω
µA
µA
µA
µA
V
µs
V
PS=0V
PS=IN1A=IN1B=5V
V
IN
=5V
V
IN
=0V
I
FAULT
=1mA
V
FAULT
=5V
I
OUT
=1.5A,sum of upper and lower
I
OUT
=0.5A,sum of upper and lower
RNFXS=0V
RNFX=0V
VREFX=0V
VREFX=3V
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© 2012 ROHM Co., Ltd. All rights reserved.
2/8
2012.02 - Rev.A
BD63821EFV, BD63823EFV
●Terminal
function and Application circuit diagram
Pin No.
Pin name
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
OUT1B
RNF1
RNF1S
OUT1A
NC
VCC1
NC
GND
CR
VREF1
VREF2
PS
FAULT
Ground terminal
H bridge output terminal
Connection terminal of resistor
For output current detection
Input terminal of current limit
comparator
H bridge output terminal
Non connection
Power supply terminal
Non connection
Ground terminal
Connection terminal of CR
for setting chopping frequency
Current limit value setting terminal
Current limit value setting terminal
Power save terminal
Fault signal output terminal
Technical Note
Pin No.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Pin name
LOCK
IN1A
IN1B
TEST
IN2A
IN2B
NC
VCC2
NC
OUT2A
RNF2S
RNF2
OUT2B
NC
Function
Motor lock signal output terminal
H bridge control terminal
H bridge control terminal
Terminal for testing
H bridge control terminal
H bridge control terminal
Non connection
Power supply terminal
Non connection
H bridge output terminal
Input terminal of current limit
comparator
Connection terminal of resistor
for output current detection
H bridge output terminal
Non connection
●Application
circuit diagram
Constant voltage control or external PWM control (when not using the motor lock detection function)
3.3V or 5.0V
VREF1
11
VREF2
12
FAULT
10kΩ
+
-
1/5
RNF1S
1/5
RNF2S
+
-
Regulator
14
+
-
+
-
When using the fault output function
⇒Pull
up resistor 5kΩ~100kΩ.
Not using
⇒Connect
to GND.
Blank time
PWM control
CR
10
OSC
TSD
UVLO
OCP
OVLO
15
Bypass capacitor.
Setting range is
100uF~470uF(electrolytic)
0.01uF~0.1uF(multilayer ceramic etc.)
Be sure to short VCC1 & VCC2.
LOCK
Control input terminal.
7
5
VCC1
OUT1A
IN1A
16
IN1B
17
Control logic
Predriver
Forward
Reverse
BRAKE
Open
2
3
4
22
24
27
26
25
M
OUT1B
RNF1
RNF1S
VCC2
OUT2A
100µF
0.1µF
Power save terminal
IN2A
19
IN2B
20
PS
13
Terminal for testing
Connect to GND.
18
Forward
Reverse
BRAKE
Open
M
OUT2B
RNF2
RNF2S
GND
TEST
1,9
Fig.1Application circuit diagram of constant voltage control or external PWM control
(When not using the motor lock detection function)
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© 2012 ROHM Co., Ltd. All rights reserved.
3/8
2012.02 - Rev.A
BD63821EFV, BD63823EFV
●Points
to notice for terminal description
○PS/
Power save terminal
PS can make circuit standby state and make motor output open
Please be careful of delay 40μs(max.) before it is returned from off state to normal state.
PS
State
L
H
POWER SAVE (STANDBY)
ACTIVE
Technical Note
○IN1A,I
N1B, IN2A, IN2B/ H bridge control terminal
Input
Output
IN1A
IN1B
OUT1A
OUT1B
PS
IN2A
IN2B
OUT2A
OUT2B
L
X
X
OPEN
OPEN
H
L
L
OPEN
OPEN
H
H
L
H
L
H
L
H
L
H
H
H
H
L
L
X: H or L
State
POWER SAVE (STANDBY)
STOP
FORWARD
REVERSE
BRAKE
●Protection
Circuits
○Thermal
Shutdown (TSD)
This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C
(Typ.), the motor output becomes open. Also, when the temperature returns to under 150°C (Typ.), it automatically
returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat
overdrive can lead to destruction.
○Over
Current Protection (OCP)
This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted
each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to open condition
when the regulated threshold current flows for 4μs (typ.). It returns with power reactivation or a reset of the PS terminal.
The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor
output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to
take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power
reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may
generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over
current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as
a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP
detection current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the
output rating should not be applied.
○Under
Voltage Lock Out (UVLO)
This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply
under voltage. When the applied voltage to the VCC terminal goes under 15V (Typ.), the motor output is set to open. This
switching voltage has a 1V (Typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit
does not operate during power save mode.
○Over
Voltage Lock Out (OVLO)
This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over
voltage. When the applied voltage to the VCC terminal goes over 32V (Typ.), the motor output is set to OPEN. This
switching voltage has a 1V (Typ.) hysteresis and a 4μs (Typ.) mask time to prevent false operation by noise etc. Although
this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power
supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this
circuit does not operate during power save mode.
○Ghost
Supply Prevention (protects against malfunction when power supply is disconnected)
If a signal (IN1A, IN1B, IN2A, IN2B, PS, VREF1, VREF2) is input when there is no power supplied to this IC, there is a
function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from
these input terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the
circuit even when voltage is supplied to these input terminals while there is no power supply.
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4/8
2012.02 - Rev.A
BD63821EFV, BD63823EFV
Technical Note
●Thermal
derating curve
HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
Measurement machine:TH156(Kuwano Electric)
Measurement condition:ROHM board
Board size:70mm*70mm*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with solder.
Board①:1-layer board (Copper foil on the back 0mm)
Board②:2-layer board (Copper foil on the back 15mm*15mm)
Board③:2-layer board (Copper foil on the back 70mm*70mm)
Board④:4-layer board (Copper foil on the back 70mm*70mm)
Board①:θ
ja
=86.2°C/W
Board②:θ
ja
=67.6°C/W /W
Board③:θ
ja
=37.9°C/W
Board④:θ
ja
=26.6°C/W
5.0
4.70W
4
4.0
3.30W
Power Dissipation:Pd[W]
3.0
3
2.0
1.85W
2
1.0
1.45W
1
0
25
50
75
85 100
125
150
Ambient temperature:Ta[°C]
Fig. 2 HTSSOP-B28 Thermal derating curve
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© 2012 ROHM Co., Ltd. All rights reserved.
5/8
2012.02 - Rev.A