Analog Switch ICs Low Power Fast DPST Normally Open CMOS Analog Switch
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Maxim(美信半导体) |
| 产品种类 Product Category | Analog Switch ICs |
| Number of Switches | 2 Switch |
| Configuration | 1 x DPST |
| On Resistance - Max | 75 Ohms |
| On Time - Max | 500 ns |
| Off Time - Max | 450 ns |
| 工作电源电压 Operating Supply Voltage | +/- 15 V |
| 最小工作温度 Minimum Operating Temperature | - 55 C |
| 最大工作温度 Maximum Operating Temperature | + 125 C |
| 安装风格 Mounting Style | Through Hole |
| 封装 / 箱体 Package / Case | CDIP-Narrow-16 |
| 高度 Height | 3.3 mm (Max) |
| 长度 Length | 21.34 mm (Max) |
| Supply Type | Dual Supply |
| 宽度 Width | 7.87 mm (Max) |
| Supply Current - Max | +/- 0.01 mA |
| Maximum Dual Supply Voltage | +/- 18 V |
| Pd-功率耗散 Pd - Power Dissipation | 800 mW |
| IH5144MJE-883B | IH5144CWE | 8100610EA | 8100604EA | 8100603EA | |
|---|---|---|---|---|---|
| 描述 | Analog Switch ICs Low Power Fast DPST Normally Open CMOS Analog Switch | Analog Switch ICs Low Power Fast DPST Normally Open CMOS Analog Switch | Analog Switch ICs CMOS TTL Compatible | Analog Switch ICs CMOS TTL Compatible | Analog Switch ICs CMOS TTL Compatible |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | - | SOIC | DIP | DIP | DIP |
| 包装说明 | - | SO-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | CERAMIC, DIP-16 |
| 针数 | - | 16 | 16 | 16 | 16 |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | - | DPST | SPDT | DPST | DPST |
| JESD-30 代码 | - | R-PDSO-G16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | - | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | - | 2 | 2 | 2 | 1 |
| 功能数量 | - | 1 | 2 | 2 | 1 |
| 端子数量 | - | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | - | 75 Ω | 75 Ω | 75 Ω | 75 Ω |
| 最高工作温度 | - | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | -55 °C |
| 输出 | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - |
| 封装主体材料 | - | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | - | SOP | DIP | DIP | DIP |
| 封装等效代码 | - | SOP16,.4 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | - | 240 | 240 | 240 | 240 |
| 电源 | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | - | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | - | YES | NO | NO | NO |
| 最长断开时间 | - | 125 ns | 350 ns | 250 ns | 250 ns |
| 最长接通时间 | - | 200 ns | 450 ns | 375 ns | 375 ns |
| 切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 20 | 20 | 20 | 20 |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 |
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