REVISIONS
LTR
A
B
DESCRIPTION
Drawing updated to reflect current requirements. -ro
Update drawing as part of 5 year review. -rrp
DATE (YR-MO-DA)
00-08-28
06-03-20
APPROVED
R. MONNIN
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
PREPARED BY
JOSEPH A. KERBY
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
D. H. JOHNSON
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, DUAL LOW OFFSET,
MATCHED OPERATIONAL AMPLIFIER
MONOLITHIC SILICON
DRAWING APPROVAL DATE
88-09-29
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
8
5962-87715
DSCC FORM 2233
APR 97
5962-E109-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87715
01
C
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
OP-207A, LT1002A
Circuit function
Dual, ultra-low offset, matched
operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
C
Descriptive designator
GDIP1-T14 or CDIP2-T14
Terminals
14
Package style
Dual-in-line
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (V
S
) .............................................................
±22
V
Internal power dissipation (P
D
) ............................................
Differential input voltage ......................................................
Input voltage (V
I
) .................................................................
Output short circuit duration ................................................
Storage temperature range .................................................
Lead temperature (soldering, 60 seconds) ..........................
Thermal resistance, junction-to-case (θ
JC
) .........................
1.4 Recommended operating conditions.
Supply voltage range (V
S
) ...........................................................................
±15
V
Ambient operating temperature range (T
A
) .................................................. -55°C to +125°C
500 mW 1/
±30
V
±22
V 2/
Indefinite
-65°C to +150°C
300°C
See MIL-STD-1835
1/ Maximum ambient temperature for rating is 106°C, derate above maximum ambient temperature 11.3 mW/°C.
2/ For supply voltages less than
±22
V, the absolute maximum input voltage is equal to the supply voltage.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87715
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87715
SHEET
B
3
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
2,3
Device
type
Min
01
Limits
Max
100
230
Unit
Input offset voltage
V
IO
µV
Average input offset
voltage drift
Input offset current
TCV
IO
I
IO
T
A
= -55°C, +125°C
8
01
1.3
µV/°C
1
2,3
01
2.8
5.6
nA
Input bias current
I
IB
1
2,3
01
±3.0
±5.6
nA
Output voltage swing
V
O
R
L
≥
10 kΩ
R
L
≥
2 kΩ
R
L
≥
1 kΩ
R
L
≥
2 kΩ
4
01
±12.5
±12.0
±10.0
V
5,6
1
1,2,3
01
01
01
±12.0
240
±13
106
103
01
20
32
01
01
200
150
01
0.5
-0.5
mV
12
nV Hz
V/mV
µV/V
mW
V
dB
Power consumption
Input voltage range 2/
Common mode rejection
ratio
P
D
IVR
CMRR
No load, both amplifiers,
T
A
= +25°C
V
CM
= IVR =
±13
V
1
2,3
Power supply rejection
ratio
PSRR
V
S
=
±3
V to
±18
V
1
2,3
Input noise voltage
Large signal voltage
gain
e
n
A
VO
f
O
= 1000 Hz, T
A
= +25°C
R
L
≥
2 kΩ, V
O
=
±10
V
7
4
5,6
Offset adjustment
voltage range
Vadj+
Vadj-
R
P
= 20 kΩ, T
A
= +25°C
1
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87715
SHEET
B
4
TABLE I. Electrical performance characteristics – Continued.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
1
Device
type
01
Min
5
-55
Limits
Max
58
-5
90
180
Unit
Output short circuit
current
I
OS+
I
OS-
T
A
= +25°C
mA
Input offset voltage
match
∆V
IO
1
2,3
01
µV
Average non-inverting
bias current
∆I
B+
1
2,3
01
±3.5
±6.0
nA
Non-inverting offset
current
∆I
O+
1
2,3
01
±3.5
±6.5
nA
Inverting offset
current
∆I
O-
1
2,3
01
±3.5
±6.5
nA
Common mode rejection
ratio match
∆CMRR
V
CM
= IVR =
±13
V
1
2,3
01
103
100
dB
Power supply rejection
ratio match
∆PSRR
V
S
=
±3
V to
±18
V
1
2,3
01
32
51
µV/V
Channel separation
CS
T
A
= +25°C
4
01
126
dB
1/ Unless otherwise specified, V
S
=
±15
V, R
S
= 50
Ω,
and V
CM
= 0 V.
2/ IVR is defined as the V
CM
range used for the CMR test.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87715
SHEET
B
5
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