Analog Switch ICs 50ohm, Dual SPST Analog Switches in UCSP
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | MO-187CAA, MSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 正常位置 | NO/NC |
| 信道数量 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 标称断态隔离度 | 72 dB |
| 通态电阻匹配规范 | 0.8 Ω |
| 最大通态电阻 (Ron) | 50 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 11 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 最长断开时间 | 60 ns |
| 最长接通时间 | 150 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| MAX4733EUA-T | MAX4731EUA- | MAX4733EUA+T | MAX4733ETA+T | MAX4732EUA+ | MAX4732EUA | MAX4733EUA | MAX4732EUA-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs 50ohm, Dual SPST Analog Switches in UCSP | Analog Switch ICs 50Ohm Dual SPST Analog Switch | Analog Switch ICs 50Ohm Dual SPST Analog Switch | Analog Switch ICs 50Ohm Dual SPST Analog Switch | Analog Switch ICs 50Ohm Dual SPST Analog Switch | Analog Switch ICs 50 Ohm, Dual SPST Analog Switches in UCSP | Analog Switch ICs 50 Ohm, Dual SPST Analog Switches in UCSP | Analog Switch ICs 50ohm, Dual SPST Analog Switches in UCSP |
| 是否无铅 | 含铅 | - | 不含铅 | - | 不含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | - | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | MO-187CAA, MSOP-8 | - | TSSOP, TSSOP8,.19 | - | TSSOP, | MO-187CAA, MSOP-8 | MO-187CAA, MSOP-8 | MO-187CAA, MSOP-8 |
| 针数 | 8 | - | 8 | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | - | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | SPST | - | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | S-PDSO-G8 | - | S-PDSO-G8 | - | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e0 | - | e3 | - | e3 | e0 | e0 | e0 |
| 长度 | 3 mm | - | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | - | 1 | 1 | 1 | 1 |
| 正常位置 | NO/NC | - | NO/NC | - | - | NC | NO/NC | NC |
| 信道数量 | 1 | - | 1 | - | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | - | 2 | - | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | - | 8 | - | 8 | 8 | 8 | 8 |
| 标称断态隔离度 | 72 dB | - | 72 dB | - | 72 dB | 72 dB | 72 dB | 72 dB |
| 通态电阻匹配规范 | 0.8 Ω | - | 0.8 Ω | - | 0.8 Ω | 0.8 Ω | 0.8 Ω | 0.8 Ω |
| 最大通态电阻 (Ron) | 50 Ω | - | 50 Ω | - | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | - | SEPARATE OUTPUT | - | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | TSSOP | - | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP8,.19 | - | TSSOP8,.19 | - | - | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 |
| 封装形状 | SQUARE | - | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | - | 260 | NOT SPECIFIED | 260 | 240 | 240 | 240 |
| 电源 | 3/5 V | - | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | - | 1.1 mm | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 11 V | - | 11 V | - | 11 V | 11 V | 11 V | 11 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | - | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | YES | - | YES | YES | YES | YES |
| 最长断开时间 | 60 ns | - | 60 ns | - | 60 ns | 60 ns | 60 ns | 60 ns |
| 最长接通时间 | 150 ns | - | 150 ns | - | 150 ns | 150 ns | 150 ns | 150 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Matte Tin (Sn) | - | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | - | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | - | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | - | 30 | NOT SPECIFIED | NOT SPECIFIED | 20 | 20 | 20 |
| 宽度 | 3 mm | - | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm |
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