CMPT3646
w w w. c e n t r a l s e m i . c o m
SURFACE MOUNT
NPN SILICON TRANSISTOR
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMPT3646 type is
an NPN silicon transistor manufactured by the epitaxial
planar process, epoxy molded in a surface mount
package, designed for ultra high speed switching
applications.
MARKING CODE: C2R
SOT-23 CASE
MAXIMUM RATINGS:
(TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
SYMBOL
VCBO
VCES
VCEO
VEBO
IC
PD
TJ, Tstg
Θ
JA
40
40
15
5.0
200
350
-65 to +150
357
UNITS
V
V
V
V
mA
mW
°C
°C/W
ELECTRICAL CHARACTERISTICS:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
ICES
ICES
BVCBO
BVCES
BVCEO
BVEBO
VCE(SAT)
VCE(SAT)
VCE(SAT)
VCE(SAT)
VBE(SAT)
VBE(SAT)
VBE(SAT)
hFE
hFE
hFE
VCE=20V
VCE=20V, TA=65°C
IC=100µA
IC=10µA
IC=10mA
IE=100µA
IC=30mA, IB=3.0mA
IC=30mA, IB=3.0mA, TA=65°C
IC=100mA, IB=10mA
IC=300mA, IB=30mA
IC=30mA, IB=3.0mA
IC=100mA, IB=10mA
IC=300mA, IB=30mA
VCE=0.4V, IC=30mA
VCE=0.5V, IC=100mA
VCE=1.0V, IC=300mA
0.75
MAX
0.5
3.0
UNITS
µA
µA
V
V
V
V
40
40
15
5.0
0.20
0.30
0.28
0.50
0.95
1.20
1.70
120
V
V
V
V
V
V
V
30
25
15
R3 (1-February 2010)
CMPT3646
SURFACE MOUNT
NPN SILICON TRANSISTOR
ELECTRICAL CHARACTERISTICS - Continued:
(TA=25°C unless otherwise noted)
SYMBOL TEST CONDITIONS
MIN
MAX
fT
Cob
Cib
ton
toff
ts
VCE=10V, IC=30mA, f=100MHz
VCB=5.0V, IE=0, f=1.0MHz
VBE=0.5V, IC=0, f=1.0MHz
VCC=10V, IC=300mA, IB1=30mA
VCC=10V, IC=300mA, IB1=IB2=30mA
VCC=10V, IC=IB1=IB2=10mA
350
5.0
8.0
18
28
18
UNITS
MHz
pF
pF
ns
ns
ns
SOT-23 CASE - MECHANICAL OUTLINE
LEAD CODE:
1) Base
2) Emitter
3) Collector
MARKING CODE: C2R
R3 (1-February 2010)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1.
2.
If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
w w w. c e n t r a l s e m i . c o m
(001)