Analog Switch ICs
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Maxim(美信半导体) |
| 产品种类 Product Category | Analog Switch ICs |
| Number of Switches | 1 Switch |
| Configuration | 1 x 4PST |
| On Resistance - Max | 80 Ohms |
| Switch Voltage - Max | +/- 15 V |
| On Time - Max | 400 ns |
| Off Time - Max | 200 ns |
| 工作电源电压 Operating Supply Voltage | +/- 15 V |
| 最小工作温度 Minimum Operating Temperature | 0 C |
| 最大工作温度 Maximum Operating Temperature | + 70 C |
| 封装 / 箱体 Package / Case | Die |
| 高度 Height | N/A |
| 长度 Length | N/A |
| Supply Type | Dual Supply |
| 宽度 Width | N/A |
| Supply Current - Max | 10 uA |
| Dual Supply Voltage | +/- 15 V |
| Maximum Dual Supply Voltage | +/- 18 V |
| Minimum Dual Supply Voltage | +/- 4.5 V |
| NumOfPackaging | 1 |
| Switch Continuous Current | 30 mA |

| IH5047C-D- | IH5049CPE- | IH5050MJE-883B | IH5050C/D | IH5051MJE | IH5050CPE+ | IH5051CJE | IH5048ACWE | IH5048CWE | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs | Analog Switch ICs Dual SPST Low Charge Injection Normally O | Analog Switch ICs Low Charge Injection SPDT Analog Switch | Analog Switch ICs Low Charge Injection SPDT Analog Switch | Analog Switch ICs Dual SPST, Low Charge Injection Analog Switch | Analog Switch ICs Low Charge Injection SPDT | Analog Switch ICs Low Charge Injection Dual SPDT Analog Switch | Analog to Digital Converters - ADC Low Charge Injection Dual SPST Normally Open Analog Switch | Switching Voltage Regulators Low Charge Injection Dual SPST Normally Open Analog Switch |
| 是否无铅 | - | - | - | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | - | - | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | - | - | - | DIE | DIP | - | DIP | SOIC | SOIC |
| 包装说明 | - | - | - | DIE-14 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SO-16 | SO-16 |
| 针数 | - | - | - | 14 | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | - | - | - | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | - | - | - | SPDT | SPDT | SPDT | SPDT | SPST | SPST |
| JESD-30 代码 | - | - | - | R-XUUC-N14 | R-GDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | - | - | e0 | e0 | - | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | - | - | - | -15 V | -15 V | - | -15 V | -15 V | -15 V |
| 信道数量 | - | - | - | 1 | 1 | - | 1 | 1 | 1 |
| 功能数量 | - | - | - | 1 | 2 | 1 | 2 | 2 | 2 |
| 端子数量 | - | - | - | 14 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | - | - | - | 50 dB | 54 dB | - | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | - | - | - | 8 Ω | 8 Ω | - | 8 Ω | 8 Ω | 8 Ω |
| 最大通态电阻 (Ron) | - | - | - | 45 Ω | 40 Ω | 75 Ω | 45 Ω | 30 Ω | 45 Ω |
| 最高工作温度 | - | - | - | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | - | - | - | UNSPECIFIED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | - | DIE | DIP | DIP | DIP | SOP | SOP |
| 封装等效代码 | - | - | - | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.4 | SOP16,.4 |
| 封装形状 | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | - | - | - | 240 | 240 | - | 240 | 240 | 240 |
| 电源 | - | - | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| 认证状态 | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | - | - | - | 15 V | 15 V | - | 15 V | 15 V | 15 V |
| 表面贴装 | - | - | - | YES | NO | NO | NO | YES | YES |
| 最长断开时间 | - | - | - | 300 ns | 200 ns | - | 300 ns | 300 ns | 300 ns |
| 最长接通时间 | - | - | - | 600 ns | 400 ns | 600 ns | 600 ns | 600 ns | 600 ns |
| 切换 | - | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | - | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | - | - | TIN LEAD | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | - | - | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子位置 | - | - | - | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | - | NOT SPECIFIED | 20 | - | 20 | 20 | 20 |
| 输出 | - | - | - | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 端子节距 | - | - | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
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