Flip Flops SINGL D F/F POS EDGE PICOGATE
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | NXP(恩智浦) |
| 产品种类 Product Category | Flip Flops |
| RoHS | Details |
| Number of Circuits | 1 |
| Logic Family | 74LVC |
| Logic Type | D-Type Flip-Flop |
| Polarity | Inverting/Non-Inverting |
| Input Type | Single-Ended |
| 传播延迟时间 Propagation Delay Time | 4.1 ns |
| High Level Output Current | - 32 mA |
| 电源电压-最小 Supply Voltage - Min | 1.65 V |
| 电源电压-最大 Supply Voltage - Max | 5.5 V |
| 最小工作温度 Minimum Operating Temperature | - 40 C |
| 最大工作温度 Maximum Operating Temperature | + 125 C |
| 安装风格 Mounting Style | SMD/SMT |
| 封装 / 箱体 Package / Case | SOT-833 |
| 系列 Packaging | Cut Tape |
| 系列 Packaging | MouseReel |
| 系列 Packaging | Reel |
| 高度 Height | 0.46 mm |
| 长度 Length | 1.95 mm |
| Quiescent Current | 100 nA |
| 宽度 Width | 1 mm |
| Number of Input Lines | 4 |
| Number of Output Lines | 2 |
| NumOfPackaging | 3 |
| 工作电源电压 Operating Supply Voltage | 1.65 V to 5.5 V |
| Reset Type | Set, Reset |
| 工厂包装数量 Factory Pack Quantity | 5000 |

| 74LVC1G74GT115 | 74LVC1G74GM | 74LVC1G74DC | 74LVC1G74DP | |
|---|---|---|---|---|
| 描述 | Flip Flops SINGL D F/F POS EDGE PICOGATE | Flip Flops | Flip Flops | Flip Flops |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | - | QFN | TSSOP | SOIC |
| 包装说明 | - | VQCCN, SOLCC8,.08,20 | VSSOP, TSSOP8,.12,20 | 3 MM WIDTH, 0.50 MM LENGTH, PLASTIC, SOT505-2, TSSOP-8 |
| 针数 | - | 8 | 8 | 8 |
| Reach Compliance Code | - | compliant | compliant | compliant |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | - | S-PQCC-N8 | R-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | - | e4 | e4 | e4 |
| 长度 | - | 1.6 mm | 2.3 mm | 3 mm |
| 逻辑集成电路类型 | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大频率@ Nom-Sup | - | 175000000 Hz | 175000000 Hz | 175000000 Hz |
| 最大I(ol) | - | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | - | 1 | 1 | 1 |
| 位数 | - | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C |
| 输出极性 | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | VQCCN | VSSOP | TSSOP |
| 封装等效代码 | - | SOLCC8,.08,20 | TSSOP8,.12,20 | TSSOP8,.16 |
| 封装形状 | - | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | - | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度(摄氏度) | - | 260 | 260 | 260 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | - | 5.9 ns | 5.9 ns | 5.9 ns |
| 传播延迟(tpd) | - | 13.4 ns | 13.4 ns | 13.4 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 0.5 mm | 1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| 端子形式 | - | NO LEAD | GULL WING | GULL WING |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | - | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 |
| 触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | - | 1.6 mm | 2 mm | 3 mm |
| 最小 fmax | - | 200 MHz | 200 MHz | 200 MHz |
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