PACUSBD
USB Downstream Port
Terminator
Product Description
The PACUSB−D1/D2 is a single−channel USB downstream−port
termination network. It integrates EMI/RFI filter components R1 and
C1, as recommended by the USB specification as well as the required
1 5 k W p u l l
−d
o w n r e s i s t o r s ( R 2 ) t o G N D . I n a d d i t i o n ,
PACUSB−D1/D2 provides a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). The device pins will safely dissipate ESD strikes of
15
kV,
exceeding the maximum requirements of the IEC 61000−4−2
international standard. Using the MIL−STD−883D (Method 3015)
specification for Human Body Model (HBM) ESD, all pins are
protected from contact discharges to
20
kV.
There are three options for the value of the series resistor R1: 15
W,
22
W,
and 33
W.
This series resistance, plus the USB driver output
resistance, must be close to the USB cable’s characteristic impedance
of 45
W
(each side) to minimize transmission line reflections.
The PACUSB−D1/D2 is manufactured in a 5−pin SC70 or a 5−pin
SOT23 package and is available with optional lead−free finishing.
Features
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SOT23−5
CASE 527AH
SC70−5
CASE 419AC
ELECTRICAL SCHEMATIC
R1
1
C1
2
GND
C1
3
R1
R2
4
R2
5
A Low−Capacitance USB Downstream Port Terminator, EMI
Filter, and Transient Over−Voltage (ESD) Protector in a Single
Surface−Mounted Package
ESD Protection to
20
kV Contact Discharge, per
MIL−STD−883D, Method 3015
ESD Protection to
15
kV Contact Discharge, per IEC 61000−4−2
International Standard
Compact SOT23−5 and SC70−5 Package Options Save Board
Space and Lower Manufacturing Costs Compared to Discrete
Solutions
Capacitors Matched to a Precision Exceeding the USB
Specification
Pin−Compatible with ST Microelectronics USBDFxxW5 USB
Downstream Port Terminator
These Devices are Pb−Free and are RoHS Compliant
ESD Protection and Termination of USB Downstream Ports
Desktop PCs
Notebooks
Set−Top Boxes
USB Hubs
MARKING DIAGRAM
DF1R
FnR
DF1R
FnR
n
= PACUSB−D1Y5R
= PACUSB−DnYB5R
= 1, 2
ORDERING INFORMATION
Device
PACUSB−D1Y5R
PACUSB−D1YB5R
PACUSB−D2YB5R
Package
Shipping
†
SOT23−5 3000/Tape & Reel
(Pb−Free)
SC70−5 3000/Tape & Reel
(Pb−Free)
SC70−5 3000/Tape & Reel
(Pb−Free)
Applications
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2011
October, 2011
−
Rev. 3
1
Publication Order Number:
PACUSBD/D
PACUSBD
PACKAGE / PINOUT DIAGRAMS
Top View
D+ CNTR
1
DF1R
5
D+ CONN
D+ CNTR
1
FnR
Top View
5
D+ CONN
GND
D− CNTR
2
3
GND
4
D− CONN
D− CNTR
2
3
4
D− CONN
5−Pin SOT23
PACUSB−D1Y5R
5−Pin SC70
PACUSB−D1YB5R/−D2YB5R
Note 1: The “n” shown in part markings above represents either the digit “1” or “2”.
Note 2: SOT23 and SC70 package sizes may differ. These drawing are not in scale.
Table 1. PIN DESCRIPTIONS
Pins
1
2
3
4
5
Name
D+ CNTR
GND
D− CNTR
D− CONN
D+ CONN
Description
D+ Data to the USB Controller Circuitry
Ground Pin
D− Data to the USB Controller Circuitry
D− Data to the USB Connector
D+ Data to the USB Connector
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Power Dissipation per Resistor
Package Power Dissipation
Voltage on any Pin (DC)
Rating
−65
to +150
100
200
6
Units
C
mW
mW
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature
Rating
−40
to +85
Units
C
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PACUSBD
SPECIFICATIONS (Cont’d)
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R1
R1
R2
TCR
C1
Parameter
Resistance of R1 Resistor
(PACUSB−D2YB5R)
Resistance of R1 Resistor
(PACUSB−D1Y5R,
−D1YB5R)
Resistance of R2 Resistor
Temperature Coefficient of Resistance
Capacitance of C1 Capacitor
T
A
= 25C
T
A
= 25C
T
A
= 25C
(Note 1)
0 V DC, 30 mV AC, 1 MHz, 25C
2.5 V DC, 30 mV AC, 1 MHz, 25C
TOL
CM
I
LEAK
V
RB
V
SIG
Matching Tolerance of C1 Capacitors
Diode Leakage Current to GND
Diode Reverse Bias Voltage
Signal Voltage:
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
MIL−STD−883D, Method 3015 (HBM)
IEC 61000−4−2 Contact Discharge
Clamping Voltage under ESD Discharge
1 MHz, 25C
Measured at 3.3 V DC, 25C
I
LOAD
= 10
mA,
T
A
= 25C
I
LOAD
= 10 mA, T
A
= 25C
I
LOAD
= 10 mA, T
A
= 25C
Pins 1, 3 (Notes 2 and 3)
Pins 4, 5 (Note 2)
Pins 4, 5 (Note 2)
MIL−STD−883D, Method 3015 +8 kV
(Note 4)
MIL−STD−883D, Method 3015
−8
kV
(Note 4)
5.5
5.6
−0.4
4
20
15
12
−7
V
V
6.8
−0.8
9.0
−1.5
1
37.6
25.6
Conditions
Min
12
26.4
Typ
15
33.0
15
1300
47.0
32.0
56.4
38.4
2
100
Max
18
39.6
Units
W
W
kW
ppm/C
pF
pF
%
nA
V
V
V
ESD
kV
V
CL
1. Electrical operating characteristics guaranteed over standard operating conditions unless specified otherwise.
2. ESD voltage applied to pins with respect to GND, one at a time; unused pins are left open.
3. Pins 1 and 3 are not connected to the USB port connector, and therefore are not exposed to external ESD hazards. Thus, they do not require
the high ESD protection levels provided for pins 4 and 5.
4. ESD Clamping Voltage is measured at the opposite end of R1 from the pin to which the ESD discharge is applied (e.g., if ESD is applied
to pin 6, then the clamping voltage is measured at pin 1).
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PACUSBD
PERFORMANCE INFORMATION
Capacitance vs. Voltage
The C1 capacitance value as a function of DC voltage across it is presented in Figure 1. The curve is normalized to
a capacitance of 1.0 capacitance units at 2.5 V DC.
1.6
Normalized C1 Capacitance
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
1
2
3
DC Voltage
4
5
6
Figure 1. Diode Capacitance vs. DC Voltage (Normalized)
Insertion Loss vs. Frequency Characteristics
Figure 2. Insertion Loss vs. Frequency Performance Curve, PACUSB−D1 (SOT23−5)
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4
PACUSBD
PERFORMANCE INFORMATION (Cont’d)
Figure 3. Insertion Loss vs. Frequency Performance Curve, PACUSB−D2 (SOT23−5)
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