Ultra Small
μClamp
®
4-Line ESD Protection
PROTECTION PRODUCTS - MicroClamp
®
Description
μClamp
®
TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace multilayer varistors (MLVs) in por-
table applications such as cell phones, notebook com-
puters, and other portable electronics. They feature large
cross-sectional area junctions for conducting high tran-
sient currents. This device offers desirable characteris-
tics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
The
μClamp
®
0554T is in a 4-pin SLP0808P4T package.
It measures 0.8 x 0.8 mm with a nominal height of only
0.3mm. The leads are finished with lead-free NiPdAu.
Each device will protect four lines operating at 5 volts.
It gives the designer the flexibility to replace multiple
single line devices in space constrained applications.
They may be used to meet the ESD immunity require-
ments of IEC 61000-4-2. The combination of small
size and high ESD surge capability makes them ideal
for use in portable applications such as cellular
phones, digital cameras, and tablet computers.
uClamp0554T
Features
High ESD withstand Voltage:
+/-15kV
(Contact) per
IEC 61000-4-2
Very small PCB area: 0.8mm
2
Protects up to four data lines
Low reverse current: <3nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: <7pF (VR=0V)
Low dynamic resistance: 0.70 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP0808P4T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.8 x 0.8 x 0.30 mm
Lead Pitch: 0.48mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
SIM Ports
Digital Lines
Tablet PC
Nominal Dimensions (mm)
0.48 BSC
0.80
1
Schematic & PIN Configuration
1
2
3
4
0.80
0.30
Tab
4-Line, Bidirectional
Revision 7/25/2013
1
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uClamp0554T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20
μ
s)
Maximum Peak Pulse Current (tp = 8/20
μ
s)
ESD p er IEC 61000-4-2 (Air)
1
ESD p er IEC 61000-4-2 (Contact)
1
Op erating Temp erature
Storage Temp erature
Symbol
P
p k
I
p p
V
ESD
T
J
T
STG
Value
25
2
+/- 17
+/- 15
-55 to +125
-55 to +150
Units
Watts
Amps
kV
°C
°C
Electrical Characteristics (T=25
o
C)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Symbol
V
RWM
V
BR
Conditions
Any I/O Pin
to GN D
I
t
= 1mA
Any I/O Pin
to GN D
V
RWM
= 5V, T=25°C
Any I/O Pin
to GN D
I
PP
= 2A, tp = 8/20
μ
s
Any I/O Pin
to GN D
IPP = 4A,
tlp = 0.2/100ns
IPP = 16A,
tlp = 0.2/100ns
tp = 100ns
V
R
= 0V, f = 1MHz
Any I/O Pin
to GN D
12
20.5
0.70
4.5
7
6
8.2
Minimum
Typical
Maximum
5
9.5
Units
V
V
Reverse Leakage Current
I
R
3
50
nA
Clamping Voltage
V
C
12.5
V
ESD Clamping Voltage
2
ESD Clamping Voltage
2
Dynamic Resistance
2, 3
Junction Capacitance
V
C
V
C
R
Dyn
C
j
V
V
Ohms
pF
Notes
1)ESD gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: t
p
= 100ns, t
r
= 0.2ns, I
TLP
and V
TLP
averaging window: t
1
= 70ns to
t
2
= 90ns.
3) Dynamic resistance calculated from I
pp
= 4A to I
pp
= 16A
©
2013 Semtech Corporation
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uClamp0554T
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1000
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
14
13
Peak Pulse Power - P
PP
(W)
Clamping Voltage -V
C
(V)
12
11
10
9
8
7
6
5
Waveform
Parameters:
tr = 8µs
td = 20µs
100
10
DR040412-25
4
0
0.5
1
1.5
2
2.5
1
0.1
1
10
Pulse Duration - tp (µs)
100
Peak Pulse Current - I
PP
(A)
Junction Capacitance vs. Reverse Voltage
7.0
6.0
Capacitance - C
j
(pf)
5.0
TLP Current (A)
20
4.0
3.0
2.0
1.0
f = 1 MHz
0.0
0
1
2
3
4
5
Reverse Voltage - V
R
(V)
0
0
5
30
TLP Characteristic
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
25
15
10
5
10
15
20
TLP Voltage (V)
25
30
35
ESD Clamping (+8kV Contact per IEC 61000-4-2)
70
60
50
Voltage (V)
40
30
20
10
0
-10
0
10
20
30
40
Time (ns)
50
60
70
80
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 40dB
attenuator. ESD gun return path
connected to ESD ground plane
ESD Clamping (-8kV Contact per IEC 61000-4-2)
10
0
-10
Voltage (V)
-20
-30
-40
-50
-60
-70
-10
0
10
20
30
40
50
60
70
80
Time (ns)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth.
Corrected for 50 Ohm, 40dB
attenuator. ESD gun return path
connected to ESD ground plane
©
2013 Semtech Corporation
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uClamp0554T
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1 S21
LOG
6 dB / REF 0 dB
1: - 1.6822 dB
800 MHz
0 dB
-6 dB
-12 dB
3
1
2
5
Analog Crosstalk
CH1 S21
LOG
20dB / REF 0 dB
2: - 2.5899 dB
900 MHz
3: - 11.173 dB
1.8 GHz
4: - 6.9470 dB
2.5 GHz
5: - 7.1104 dB
2.7 GHz
0 dB
-20 dB
-40 dB
-60 dB
-80 dB
4
-18 dB
-24 dB
-30 dB
-100 dB
-36 dB
-42 dB
-48 dB
-120 dB
-140 dB
1
MHz
START. 030 MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
-160 dB
START . 030 MHz
STOP 3000. 000000 MHz
©
2013 Semtech Corporation
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uClamp0554T
PROTECTION PRODUCTS
Recommended Assembly Parameters
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
0.26
0.23
0.26
0.57
0.52
0.27
Assembly Parameter
Solder Stencil Design
Aper ture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
R ecommendation
Laser cut, Electro-polished
Rectangular
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
All Dimensions are in mm
.
Land Pad.
Stencil opening
0.32
0.25
Component
Recommended Mounting Pattern
©
2013 Semtech Corporation
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