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MAX4737EBE-T

产品描述Analog Switch ICs 4.5Ohm Quad SPST Analog Switch
产品类别模拟混合信号IC    信号电路   
文件大小2MB,共16页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX4737EBE-T概述

Analog Switch ICs 4.5Ohm Quad SPST Analog Switch

MAX4737EBE-T规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码BGA
包装说明4 X 4 MM, UCSP-16
针数16
Reach Compliance Codenot_compliant
ECCN代码EAR99
模拟集成电路 - 其他类型SPST
JESD-30 代码S-PBGA-B16
JESD-609代码e0
长度2.02 mm
湿度敏感等级1
正常位置NO
信道数量1
功能数量4
端子数量16
标称断态隔离度55 dB
通态电阻匹配规范0.1 Ω
最大通态电阻 (Ron)4.5 Ω
最高工作温度85 °C
最低工作温度-40 °C
输出SEPARATE OUTPUT
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA16,4X4,20
封装形状SQUARE
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
电源3/5 V
认证状态Not Qualified
座面最大高度0.67 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)3 V
表面贴装YES
最长断开时间40 ns
最长接通时间80 ns
切换BREAK-BEFORE-MAKE
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度2.02 mm

文档预览

下载PDF文档
MAX4737/MAX4738/
MAX4739
General Description
4.5Ω Quad SPST Analog Switches in UCSP
Benefits and Features
USB 1.1 Signal Switching
● 2ns (max) Differential Skew
● -3dB Bandwidth: >300MHz
● Low 20pF On-Channel Capacitance
Low R
ON
• 4.5Ω (max) (+3V Supply)
• 3Ω (max) (+5V Supply)
● 0.4Ω (max) R
ON
Match (+3V Supply)
● 1.2Ω (max) R
ON
Flatness (+3V Supply)
● <0.5nA Leakage Current at +25°C
● High Off-Isolation: -55dB (10MHz)
● Low Crosstalk: -80dB (10MHz)
● Low Distortion: 0.03%
● +1.8V CMOS-Logic Compatible
Single-Supply Operation from +1.8V to +5.5V
Rail-to-Rail Signal Handling
The MAX4737/MAX4738/MAX4739 low-voltage, low on-
resistance (R
ON
), quad single-pole/single throw (SPST)
analog switches operate from a single +1.8V to +5.5V
supply. These devices are designed for USB 1.1 and
audio switching applications.
The MAX4737/MAX4738/MAX4739 feature 4.5Ω R
ON
(max) with 1.2Ω flatness and 0.4Ω matching between
channels. These new switches feature guaranteed
operation from +1.8V to +5.5V and are fully specified
at 3V and 5V. These switches offer break-before-make
switching (1ns) with t
ON
<80ns and t
OFF
<40ns at +2.7V.
The digital logic inputs are +1.8V logic compatible with a
+2.7V to +3.6V supply.
These switches are packaged in a chip-scale package
(UCSP™), significantly reducing the required PC board
area. The chip occupies only a 2mm x 2mm area and has
a 4 x 4 bump array with a bump pitch of 0.5mm. These
switches are also available in a 14-pin TSSOP and a
16-pin thin QFN (4mm x 4mm) package.
Applications
Battery-Operated Equipment
Audio/Video-Signal Routing
Low-Voltage Data-Acquisition Systems
Sample-and-Hold Circuits
Data-Acquisition Systems
Communications Circuits
UCSP is a trademark of Maxim Integrated Products, Inc.
19-2633; Rev 2; 1/16

MAX4737EBE-T相似产品对比

MAX4737EBE-T MAX4737EUD-T MAX4737ETE- MAX4738EUD+ MAX4737ETE+T MAX4738EUD MAX4739EUD MAX4738EUD+T
描述 Analog Switch ICs 4.5Ohm Quad SPST Analog Switch Analog Switch ICs 4.5Ohm Quad SPST Analog Switch Analog Switch ICs 4.5 Ohm Quad SPST Analog Switches in UCSP Analog Switch ICs 4.5Ohm Quad SPST Analog Switch Analog Switch ICs 4.5 Ohm Quad SPST Analog Switches in UCSP Analog Switch ICs 4.5Ohm Quad SPST Analog Switch Analog Switch ICs 4.5 Ohm Quad SPST Analog Switches in UCSP Analog Switch ICs 4.5Ohm Quad SPST Analog Switch
是否无铅 含铅 含铅 - 不含铅 不含铅 含铅 含铅 不含铅
是否Rohs认证 不符合 不符合 - 符合 符合 不符合 不符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 BGA TSSOP - TSSOP - TSSOP TSSOP TSSOP
包装说明 4 X 4 MM, UCSP-16 TSSOP, TSSOP14,.25 - TSSOP, HVQCCN, TSSOP, TSSOP14,.25 4.40 MM, MO-153-AB, TSSOP-14 TSSOP,
针数 16 14 - 14 - 14 14 14
Reach Compliance Code not_compliant not_compliant - compliant compliant not_compliant not_compliant compliant
ECCN代码 EAR99 - - EAR99 EAR99 EAR99 EAR99 EAR99
模拟集成电路 - 其他类型 SPST SPST - SPST SPST SPST SPST SPST
JESD-30 代码 S-PBGA-B16 R-PDSO-G14 - R-PDSO-G14 S-XQCC-N16 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e0 e0 - e3 - e0 e0 e3
长度 2.02 mm 5 mm - 5 mm 4 mm 5 mm 5 mm 5 mm
湿度敏感等级 1 1 - 1 1 1 1 1
信道数量 1 1 - 1 4 1 1 1
功能数量 4 4 - 4 1 4 4 4
端子数量 16 14 - 14 16 14 14 14
标称断态隔离度 55 dB 55 dB - 55 dB 80 dB 55 dB 55 dB 55 dB
通态电阻匹配规范 0.1 Ω 0.1 Ω - 0.1 Ω 0.4 Ω 0.1 Ω 0.1 Ω 0.1 Ω
最大通态电阻 (Ron) 4.5 Ω 4.5 Ω - 4.5 Ω 4.5 Ω 4.5 Ω 4.5 Ω 4.5 Ω
最高工作温度 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA TSSOP - TSSOP HVQCCN TSSOP TSSOP TSSOP
封装形状 SQUARE RECTANGULAR - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 240 245 - 260 NOT SPECIFIED 240 240 260
认证状态 Not Qualified Not Qualified - Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 0.67 mm 1.1 mm - 1.1 mm 0.8 mm 1.1 mm 1.1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.8 V 1.8 V - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
标称供电电压 (Vsup) 3 V 3 V - 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES - YES YES YES YES YES
最长断开时间 40 ns 40 ns - 40 ns 50 ns 40 ns 40 ns 40 ns
最长接通时间 80 ns 80 ns - 80 ns 100 ns 80 ns 80 ns 80 ns
技术 CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) - Matte Tin (Sn) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn)
端子形式 BALL GULL WING - GULL WING NO LEAD GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.65 mm - 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 BOTTOM DUAL - DUAL QUAD DUAL DUAL DUAL
处于峰值回流温度下的最长时间 20 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED 20 20 NOT SPECIFIED
宽度 2.02 mm 4.4 mm - 4.4 mm 4 mm 4.4 mm 4.4 mm 4.4 mm
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