EEPROM I2C BUS(2-Wre) 2K VSON008X2030 EEPROM
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | VSON-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 12 weeks |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 |
| 长度 | 3 mm |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.8/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.6 mm |
| 串行总线类型 | MICROWIRE |
| 最大待机电流 | 0.000002 A |
| 最大压摆率 | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| BR24T02NUX-WGTR | BR24T02FVJ-WGE2 | GUS-TS0A-02-1963-DG | BR24T02F-WGE2 | BR24T02FVT-WGE2 | BR24T02FVM-WGTR | BR24T02FV-WE2 | BR24T02FVM-WTR | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM I2C BUS(2-Wre) 2K VSON008X2030 EEPROM | EEPROM 6ch System Motor Driver For Car AV | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.1W, 196000ohm, 100V, 0.5% +/-Tol, -50,50ppm/Cel, 2617, | EEPROM | EEPROM I2C BUS(2-Wre) 2K TSSOP-B8 EEPROM | EEPROM I2C BUS(2-Wre) 2K MSOP8 EEPROM | EEPROM Hi-Rel Serial EEPROM of I2C BUS | EEPROM Hi-Rel Serial EEPROM of I2C BUS |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | - | - |
| 零件包装代码 | SOIC | SOIC | - | SOIC | SOIC | MSOP | - | - |
| 包装说明 | VSON-8 | TSSOP, TSSOP8,.19 | - | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | VSSOP, TSSOP8,.16 | - | - |
| 针数 | 8 | 8 | - | 8 | 8 | 8 | - | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | - | - |
| Factory Lead Time | 12 weeks | 10 weeks | - | 11 weeks | 11 weeks | 11 weeks | - | - |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | - | - |
| 数据保留时间-最小值 | 40 | 40 | - | 40 | 40 | 40 | - | - |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | - |
| I2C控制字节 | 1010DDDR | 1010DDDR | - | 1010DDDR | 1010DDDR | 1010DDDR | - | - |
| JESD-30 代码 | R-PDSO-N8 | S-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | - |
| 长度 | 3 mm | 3 mm | - | 5 mm | 4.4 mm | 2.9 mm | - | - |
| 内存密度 | 2048 bit | 2048 bit | - | 2048 bit | 2048 bit | 2048 bit | - | - |
| 内存集成电路类型 | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | - | - |
| 内存宽度 | 8 | 8 | - | 8 | 8 | 8 | - | - |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | - | - |
| 端子数量 | 8 | 8 | 20 | 8 | 8 | 8 | - | - |
| 字数 | 256 words | 256 words | - | 256 words | 256 words | 256 words | - | - |
| 字数代码 | 256 | 256 | - | 256 | 256 | 256 | - | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | - | - |
| 组织 | 256X8 | 256X8 | - | 256X8 | 256X8 | 256X8 | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | HVSON | TSSOP | - | SOP | TSSOP | VSSOP | - | - |
| 封装等效代码 | SOLCC8,.11,20 | TSSOP8,.19 | - | SOP8,.25 | TSSOP8,.25 | TSSOP8,.16 | - | - |
| 封装形状 | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMT | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | - | - |
| 并行/串行 | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 1.8/5 V | 1.8/5 V | - | 1.8/5 V | 1.8/5 V | 1.8/5 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 0.6 mm | 1.1 mm | - | 1.71 mm | 1.2 mm | 0.9 mm | - | - |
| 串行总线类型 | MICROWIRE | MICROWIRE | - | MICROWIRE | MICROWIRE | MICROWIRE | - | - |
| 最大待机电流 | 0.000002 A | 0.000002 A | - | 0.000002 A | 0.000002 A | 0.000002 A | - | - |
| 最大压摆率 | 0.002 mA | 0.002 mA | - | 0.002 mA | 0.002 mA | 0.002 mA | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | 1.7 V | 1.6 V | - | 1.6 V | 1.6 V | 1.6 V | - | - |
| 表面贴装 | YES | YES | - | YES | YES | YES | - | - |
| 技术 | CMOS | CMOS | TANTALUM NITRIDE/NICKEL CHROME | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子形式 | NO LEAD | GULL WING | - | GULL WING | GULL WING | GULL WING | - | - |
| 端子节距 | 0.5 mm | 0.65 mm | - | 1.27 mm | 0.65 mm | 0.65 mm | - | - |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 2 mm | 3 mm | - | 4.4 mm | 3 mm | 2.8 mm | - | - |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms | - | - |
| 写保护 | HARDWARE | HARDWARE | - | HARDWARE | HARDWARE | HARDWARE | - | - |
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