Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
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-
© Nexperia B.V. (year). All rights reserved.
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DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
MBD128
PUMZ1
NPN/PNP general purpose
transistors
Product data sheet
Supersedes data of 2002 May 6
2004 Oct 15
NXP Semiconductors
Product data sheet
NPN/PNP general purpose transistors
FEATURES
•
Low current (max. 100 mA)
•
Low voltage (max. 40 V)
•
Reduces number of components and boardspace.
APPLICATIONS
•
General purpose switching and amplification.
handbook, halfpage
PUMZ1
PINNING
PIN
1, 4
2, 5
3, 6
emitter
base
collector
DESCRIPTION
TR1; TR2
TR1; TR2
TR2; TR1
6
5
4
5
4
DESCRIPTION
Two independently operating NPN/PNP transistors in an
SC-88; SOT363 plastic package.
6
TR2
TR1
1
2
3
1
Top view
MAM341
MARKING
TYPE NUMBER
PUMZ1
Note
1. * = -: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
ORDERING INFORMATION
MARKING CODE
(1)
F*Z
2
3
Fig.1 Simplified outline (SC-88) and symbol.
PACKAGE
TYPE NUMBER
NAME
PUMZ1
−
DESCRIPTION
plastic surface mounted package; 6 leads
VERSION
SOT363
2004 Oct 15
2
NXP Semiconductors
Product data sheet
NPN/PNP general purpose transistors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
−
−
−
−
−
−
T
amb
≤
25
°C
−
−65
−
−65
T
amb
≤
25
°C;
note 1
−
MIN.
MAX.
PUMZ1
UNIT
Per transistor; for the PNP transistor with negative polarity
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
Per device
P
tot
Note
1. Device mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL
Per device
R
th(j-a)
Note
1. Device mounted on an FR4 printed-circuit board.
thermal resistance from junction to ambient
note 1
416
K/W
PARAMETER
CONDITIONS
VALUE
UNIT
total power dissipation
300
mW
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
open emitter
open base
open collector
50
40
5
100
200
200
200
+150
150
+150
V
V
V
mA
mA
mA
mW
°C
°C
°C
2004 Oct 15
3
NXP Semiconductors
Product data sheet
NPN/PNP general purpose transistors
CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
−
−
−
120
−
−
−
I
C
= 2 mA; V
CE
= 12 V; f = 100 MHz 100
MIN.
PUMZ1
MAX.
UNIT
Per transistor; for the PNP transistor with negative polarity
I
CBO
I
EBO
h
FE
V
CEsat
C
c
collector-base cut-off current
emitter-base cut-off current
DC current gain
collector-emitter saturation voltage
collector capacitance
TR1
TR2
f
T
Note
1. Pulse test: t
p
≤
300
μs; δ ≤
0.02.
transition frequency
I
E
= 0 A; V
CB
= 30 V
I
E
= 0 A; V
CB
= 30 V; T
j
= 150
°C
I
C
= 0 A; V
EB
= 4 V
I
C
= 1 mA; V
CE
= 6 V
I
C
= 50 mA; I
B
= 5 mA; note 1
I
E
= i
e
= 0 A; V
CB
= 12 V; f = 1 MHz
1.5
2.2
−
pF
pF
MHz
100
10
100
−
200
mV
nA
μA
nA
2004 Oct 15
4