Op Amp Dual High Speed Amplifier ±18V 8-Pin CDIP Tube
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Not Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.33.00.01 |
SVHC | Yes |
SVHC Exceeds Threshold | Yes |
类型 Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 2 |
Process Technology | BiFET |
Maximum Input Offset Voltage (mV) | 0.75@±15V |
Minimum Dual Supply Voltage (V) | ±4.5 |
Typical Dual Supply Voltage (V) | ±15 |
Maximum Dual Supply Voltage (V) | ±18 |
Maximum Input Offset Current (uA) | 0.000025@±15V |
Maximum Input Bias Current (uA) | 0.000075@±15V |
Maximum Supply Current (mA) | 7@±15V |
Power Supply Type | Dual |
Typical Slew Rate (V/us) | 22@±15V |
Typical Input Noise Voltage Density (nV/rtHz) | 75@±15V |
Typical Voltage Gain (dB) | 122.92 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.003@±15V |
Minimum PSRR (dB) | 98.42(Typ) |
Minimum CMRR (dB) | 80 |
Minimum CMRR Range (dB) | 80 to 85 |
Typical Gain Bandwidth Product (MHz) | 4.7 |
Typical Settling Time (ns) | 900 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 125 |
系列 Packaging | Tube |
Supplier Package | CDIP |
Pin Count | 8 |
Standard Package Name | DIP |
Mounting | Through Hole |
Package Height | 3.56(Max) |
Package Length | 10.29(Max) |
Package Width | 7.87(Max) |
PCB changed | 8 |
Lead Shape | Through Hole |
OP249AZ | OP249GSZ-REEL7 | OP249GSZ | |
---|---|---|---|
描述 | Op Amp Dual High Speed Amplifier ±18V 8-Pin CDIP Tube | Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N T/R | Op Amp Dual High Speed Amplifier ±18V 8-Pin SOIC N Tube |
欧盟限制某些有害物质的使用 | Not Compliant | Compliant | Compliant |
ECCN (US) | EAR99 | EAR99 | EAR99 |
Part Status | Active | Active | Active |
HTS | 8542.33.00.01 | 8542.33.00.01 | 8542.33.00.01 |
类型 Type |
High Speed Amplifier | High Speed Amplifier | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier | High Speed Amplifier | High Speed Amplifier |
Number of Channels per Chip | 2 | 2 | 2 |
Process Technology | BiFET | BiFET | BiFET |
Maximum Input Offset Voltage (mV) | 0.75@±15V | 2@±15V | 2@±15V |
Minimum Dual Supply Voltage (V) | ±4.5 | ±4.5 | ±4.5 |
Typical Dual Supply Voltage (V) | ±15 | ±15 | ±15 |
Maximum Dual Supply Voltage (V) | ±18 | ±18 | ±18 |
Maximum Input Offset Current (uA) | 0.000025@±15V | 0.000025@±15V | 0.000025@±15V |
Maximum Input Bias Current (uA) | 0.000075@±15V | 0.000075@±15V | 0.000075@±15V |
Maximum Supply Current (mA) | 7@±15V | 7@±15V | 7@±15V |
Power Supply Type | Dual | Dual | Dual |
Typical Slew Rate (V/us) | 22@±15V | 22@±15V | 22@±15V |
Typical Input Noise Voltage Density (nV/rtHz) | 75@±15V | 75@±15V | 75@±15V |
Typical Voltage Gain (dB) | 122.92 | 120.83 | 120.83 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.003@±15V | 0.003@±15V | 0.003@±15V |
Minimum PSRR (dB) | 98.42(Typ) | 98.42(Typ) | 98.42(Typ) |
Minimum CMRR (dB) | 80 | 76 | 76 |
Minimum CMRR Range (dB) | 80 to 85 | 75 to 80 | 75 to 80 |
Typical Gain Bandwidth Product (MHz) | 4.7 | 4.7 | 4.7 |
Typical Settling Time (ns) | 900 | 900 | 900 |
Shut Down Support | No | No | No |
Minimum Operating Temperature (°C) | -55 | -40 | -40 |
Maximum Operating Temperature (°C) | 125 | 85 | 85 |
系列 Packaging |
Tube | Tape and Reel | Tube |
Supplier Package | CDIP | SOIC N | SOIC N |
Pin Count | 8 | 8 | 8 |
Standard Package Name | DIP | SOP | SOP |
Mounting | Through Hole | Surface Mount | Surface Mount |
Package Height | 3.56(Max) | 1.5(Max) | 1.5(Max) |
Package Length | 10.29(Max) | 5(Max) | 5(Max) |
Package Width | 7.87(Max) | 4(Max) | 4(Max) |
PCB changed | 8 | 8 | 8 |
Lead Shape | Through Hole | Gull-wing | Gull-wing |
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