Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> FH8065802064212S-R26M

FH8065802064212S-R26M: 产品描述CPU - Central Processing Units CORE i3-5157U 2.5GHz 64BIT MPU FCBGA1168; 产品类别半导体嵌入式处理器和控制器; 文件大小3MB，共133页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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FH8065802064212S-R26M概述

CPU - Central Processing Units CORE i3-5157U 2.5GHz 64BIT MPU FCBGA1168

FH8065802064212S-R26M规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units
RoHS	Details
产品 Product	Mobile Processors
封装 / 箱体 Package / Case	FCBGA-1168
Family	Intel Core i3
Core	Intel Core i3
Code Name	Broadwell
Embedded Options	Non-Embedded
Number of Cores	2 Core
TDP - Max	28 W
Maximum Clock Frequency	2.5 GHz
Data Bus Width	64 bit
Memory Size	16 GB
Memory Type	DDR3L-1333/1600, LPDDR3-1600/1866
System Bus Type	DMI2
System Bus Speed	5 GT/s
Cache Memory	3 MB
最大工作温度 Maximum Operating Temperature	+ 105 C
系列 Packaging	Tray
Package / Case Size	40 mm x 24 mm x 1.3 mm
安装风格 Mounting Style	SMD/SMT
CPU Configuration - Max	1 Configuration
Intel Hyper-Threading Technology	With HT Technology
Intel Virtualization Technology - VT	With VT
Lithography - Process Technology	14 nm
Moisture Sensitive	Yes
Number of Displays Supported	3 Display
Number of Memory Channels	2 Channel
Number of PCI Express Lanes	12 Lane
Number of Threads	4 Thread
PCIe Configurations	4x1 + 2x4
PCIe Revision	Revision 2.0
工厂包装数量 Factory Pack Quantity	1

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Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

Supporting 5th Generation Intel

Core

™

Processor based on

Desktop H-Processor Line

June 2015

Order No.: 332376-001v1

Contents—Processor

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

Supported Technologies.........................................................................................11

Interfaces............................................................................................................ 12

Power Management Support...................................................................................12

Thermal Management Support................................................................................13

Package Support...................................................................................................13

Processor Testability............................................................................................. 13

Terminology.........................................................................................................13

Related Documents............................................................................................... 17

2.0 Interfaces................................................................................................................... 18

2.1 System Memory Interface...................................................................................... 18

2.1.1 System Memory Technology Supported.......................................................19

2.1.2 System Memory Timing Support................................................................. 20

2.1.3 System Memory Organization Modes........................................................... 20

2.1.4 System Memory Frequency........................................................................ 22

2.1.5 Intel

Fast Memory Access (Intel

FMA) Technology Enhancements............... 22

2.1.6 Data Scrambling....................................................................................... 22

2.2 PCI Express* Interface.......................................................................................... 23

2.2.1 PCI Express* Support................................................................................ 23

2.2.2 PCI Express* Architecture.......................................................................... 24

2.2.3 PCI Express* Configuration Mechanism........................................................ 24

2.3 Direct Media Interface (DMI).................................................................................. 26

2.4 Processor Graphics................................................................................................28

2.5 Processor Graphics Controller (GT)..........................................................................28

2.5.1 3D and Video Engines for Graphics Processing.............................................. 29

2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31

2.6 Digital Display Interface (DDI)................................................................................31

2.7 Intel

Flexible Display Interface (Intel

FDI)............................................................ 37

2.8 Platform Environmental Control Interface (PECI)....................................................... 37

2.8.1 PECI Bus Architecture................................................................................37

3.0 Technologies............................................................................................................... 39

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 39

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 43

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 44

3.4 Intel

Turbo Boost Technology 2.0..........................................................................45

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................45

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................46

3.7 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)..... 46

3.8 Intel

64 Architecture x2APIC................................................................................ 47

3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48

3.10 Execute Disable Bit..............................................................................................48

3.11 Supervisor Mode Execution Protection (SMEP)........................................................48

June 2015

Order No.: 332376-001v1

Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

Processor—Contents

4.0 Power Management.................................................................................................... 49

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 50

4.2 Processor Core Power Management......................................................................... 51

4.2.1 Enhanced Intel SpeedStep

Technology Key Features....................................51

4.2.2 Low-Power Idle States............................................................................... 52

4.2.3 Requesting Low-Power Idle States...............................................................53

4.2.4 Core C-State Rules....................................................................................54

4.2.5 Package C-States......................................................................................55

4.2.6 Package C-States and Display Resolutions.................................................... 58

4.3 Integrated Memory Controller (IMC) Power Management............................................60

4.3.1 Disabling Unused System Memory Outputs................................................... 60

4.3.2 DRAM Power Management and Initialization..................................................60

4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................63

4.3.4 DDR Electrical Power Gating (EPG).............................................................. 63

4.4 PCI Express* Power Management............................................................................63

4.5 Direct Media Interface (DMI) Power Management...................................................... 63

4.6 Graphics Power Management..................................................................................63

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................63

4.6.2 Graphics Render C-State............................................................................63

4.6.3 Intel

Graphics Dynamic Frequency............................................................ 64

5.0 Thermal Management................................................................................................. 65

5.1 Desktop Processor Thermal Profiles......................................................................... 66

5.1.1 Processor Thermal Profile........................................................................... 67

5.2 Thermal Metrology................................................................................................ 68

5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 68

5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 70

5.5 Thermal Specifications...........................................................................................71

5.6 Processor Temperature..........................................................................................72

5.7 Adaptive Thermal Monitor...................................................................................... 72

5.8 THERMTRIP# Signal.............................................................................................. 75

5.9 Digital Thermal Sensor.......................................................................................... 76

5.9.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................76

5.10 Intel

Turbo Boost Technology Thermal Considerations............................................77

5.10.1 Intel

Turbo Boost Technology Power Control and Reporting.........................77

5.10.2 Package Power Control.............................................................................78

6.0 Signal Description....................................................................................................... 79

6.1 System Memory Interface Signals........................................................................... 79

6.2 Memory Reference and Compensation Signals.......................................................... 81

6.3 Reset and Miscellaneous Signals............................................................................. 82

6.4 PCI Express* Interface Signals............................................................................... 83

6.5 Display Interface Signals....................................................................................... 83

6.6 Direct Media Interface (DMI).................................................................................. 83

6.7 Phase Locked Loop (PLL) Signals.............................................................................84

6.8 Testability Signals.................................................................................................84

6.9 Error and Thermal Protection Signals....................................................................... 85

6.10 Power Sequencing Signals.................................................................................... 85

6.11 Processor Power Signals.......................................................................................86

6.12 Sense Signals..................................................................................................... 86

6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................86

Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

June 2015

Order No.: 332376-001v1

Contents—Processor

6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 87

7.0 Electrical Specifications.............................................................................................. 88

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

Integrated Voltage Regulator..................................................................................88

Power and Ground Lands ...................................................................................... 88

Voltage Identification (VID).............................................................................. 88

Reserved or Unused Signals................................................................................... 93

Signal Groups.......................................................................................................93

Test Access Port (TAP) Connection.......................................................................... 95

DC Specifications................................................................................................. 95

Voltage and Current Specifications.......................................................................... 96

8.0 Package Specifications..............................................................................................102

8.1 LGA Package Specifications.................................................................................. 102

8.1.1 Package Mechanical Drawing.................................................................... 102

8.1.2 Processor Component Keep-Out Zone........................................................ 102

8.1.3 Package Loading Specifications................................................................. 103

8.1.4 Package Handling Guidelines.................................................................... 103

8.1.5 Package Insertion Specifications................................................................103

8.1.6 Processor Mass Specification.....................................................................104

8.1.7 Processor Materials..................................................................................104

8.1.8 Processor Markings..................................................................................104

8.1.9 Processor Land Coordinates...................................................................... 104

8.1.10 Processor Storage Specifications..............................................................106

8.2 BGA Package Specifications.................................................................................. 107

8.2.1 Package Mechanical Specifications............................................................. 107

8.2.2 Package Loading Specifications................................................................. 108

8.2.3 Package Storage Specifications................................................................. 108

9.0 Processor Ball and Signal Information...................................................................... 109

June 2015

Order No.: 332376-001v1

Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

FH8065802064212S-R26M

FH8065802064212S-R26M在线购买

FH8065802064212S-R26M概述

FH8065802064212S-R26M规格参数

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