operating at up to 24MHz. It includes 256KB of flash
memory, 32KB of SRAM, a 2KB instruction cache,
and integrated high-performance analog peripherals.
The MAX32600 is available in the following package
options: 192-ball, 12mm x 12mm CTBGA; 120-ball,
7mm x 7mm CTBGA; and 108-ball, 5.4mm x 4.3mm WLP.
Benefits and Features
Applications
●
●
●
●
Wearable Medical Devices
Pulse Oximetry Measurement
Galvanic Skin Response Measurement
Blood Glucose Metering
Simplified Functional Diagram
MAX32600
ANALOG FRONT-END
4 × SPST ANALOG
SWITCHES
16 S/E OR 8 DIFF
MUX INPUTS
TEMP SENSOR,
CALIBRATION MUX
2 × 12-BIT
DACS
16-BIT ADC
WITH PGA
2 × 8-BIT
DACS
NVIC
2
ARM CORTEX-M3 24MHz
4 × COMP/
AMPLIFIERS
PROGRAMMABLE
VOLTAGE REFERENCE
8 × PROGRAMMABLE
LED DRIVERS
3 × SPI MASTER
2 × UART
32KB SRAM
CRC32/16
GENERATOR
2 × I
2
C MASTER
I
2
C SLAVE
2 × WATCHDOG TIMER
24MHz INTERNAL OSC
TRUST PROTECTION UNIT
●
Integrated AFE Enables Precision Wellness
Measurements with Minimal Discretes
• 16-Bit ADC with Input Mux and PGA
• Up to 500ksps Conversion Rate
• PGA with Gain of 1, 2, 4, and 8 and Bypass Mode
• Differential 8:1 or Single-Ended 16:1 Input Mux
• Internal Mux Inputs for Measuring V
DDA3
• Internal or External Voltage Reference
• Programmable Buffers for ADC and DACs
• Two 12-Bit DACs and Two 8-Bit DACs
•
Four Operational Amplifiers
• Four Low-Power Comparators
• Four Uncommitted SPST Analog Switches
• Four Ground Switches
• Up to Eight 100mA LED Driver Pairs (Sink)
• Internal Temperature Sensor
●
Secure Valuable IP and Data with Robust On-Board
Trust Protection Unit
• Trust Protection Unit for End-to-End Security
• AES Hardware Engine
• µMAA for ECDSA and RSA
• True Random Number Generator (TRNG)
• Fast-Erase SRAM for Secure Key Storage
●
Industry’s Lowest Overall System Power Increases
Battery Life
• 175µA/MHz Active Power Executing Code from Cache
• 1.25µA Current Consumption with Real-Time Clock
Enable in LP0
• 1.8µA Current Consumption with Data Retention and
Fast 15µs Wakeup in LP1
• Peripheral Clock Control
• 6-Channel DMA Engine Enables Intelligent
Peripheral Operation While Micro is in Sleep Mode
●
Flexible Package Options
• 120-Ball CTBGA, 0.5mm Pitch, 7mm x 7mm
• 192-Ball CTBGA, 0.65mm Pitch, 12mm x 12mm
• 108-Bump WLP, 0.4mm Pitch, 5.4mm x 4.3mm
Additional Benefits and Features
and
Ordering Information
appear at end of data sheet.
ARM and Cortex are registered trademarks of ARM Limited (or
its subsidiaries) in the EU and/or elsewhere. All rights reserved.
256KB FLASH
USB
FULL SPEED
64 GPIOs
AES ENGINE
MAA
TRNG
UNIQUE ID
INSTANT ERASE
KEY STORAGE
SUPPLY VOLTAGE
MONITORS
4 × 32-BIT
TIMER
32-BIT REAL-TIME CLOCK
WITH TIME OF DAY ALARM
LCD CONTROLLER
96/128/160
SEGMENTS
JTAG
SEE THE
SELECTOR GUIDE
FOR CONFIGURATION DETAILS.
19-6947; Rev 7; 6/17
MAX32600
Wellness Measurement Microcontroller
Absolute Maximum Ratings
Voltage Range on V
DD
and V
DDA3
with
Respect to GND ...............................................-0.3V to +3.6V
Voltage Range on V
BUS
.........................................-0.3V to 5.5V
Voltage Range on Any Lead with
Respect to GND (excluding V
BUS
)....... -0.3V to (V
DD
+ 0.5V)
Voltage Range on Analog Pins with
Respect to GND ............................................. -0.3V to V
DDA3
Total Current into V
DD
/V
DDA3
Power Lines (Sink) ..........100mA
Total Current Source V
DD
Power Lines (Sink) .................100mA
Output Current (Sink) by Any I/O Pin .................................25mA
Output Current (Source) by Any I/O Pin............................-25mA
Output Current (Source) by V
DDIO
..................................100mA
Output Current (Sink) by LED Pins ..................................135mA
Output Current (Source) by V
REG18
..................................50mA
Operating Temperature Range ........................... -40°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
108 WLP
Junction-to-Ambient Thermal Resistance (θ
JA
) .....32.99°C/W
120 CTBGA
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........32°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................9°C/W
192 CTBGA
Junction-to-Ambient Thermal Resistance (θ
JA
) .....29.50°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ............9.40°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Recommended DC Operating Conditions
(V
DD
= V
RST
to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
Digital Domain Voltage
Analog Domain Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage
for Supply
Power-Fail Reset Voltage
Power-On-Reset Release
Voltage
RAM Data Retention Voltage
LP3 Active Current
(Note 4)
LP2 Current
LP1 Current
LP0 Current
LP2 Mode Resume Time
SYMBOL
V
DD
V
DDA3
V
REG18
V
PFW
V
RST
V
SPOR
V
DRV
I
DDLP3
Cache disabled, f
CK
= 24MHz
Cache enabled, execution from cache,
100% hit rate, f
CK
= 24MHz
One PMU channel enabled
Each additional PMU channel
CONDITIONS
(Note 3)
MIN
1.8
2.3
TYP
MAX
3.6
3.6
UNITS
V
V
V
V
V
1.8
Monitors V
DD
, PFWVSBIT = 0x0016
Monitors V
DD
Monitors V
DD
or V
DDB
1.0
5
6.10
1.25
200
1.8
1.4
1250
850
0
2.525
1.765
1.8
V
V
mA
mA
µA
µA
nA
µs
I
DDLP2
I
DDLP1
I
DDLP0
t
ONLP2
RTC enabled, V
DD
supply current
RTC disabled, V
DD
supply current
RTC enabled, V
DD
supply current
RTC disabled, V
DD
supply current
One PMU channel active
www.maximintegrated.com
Maxim Integrated
│
2
MAX32600
Wellness Measurement Microcontroller
Recommended DC Operating Conditions (continued)
(V
DD
= V
RST
to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
LP1 Mode Resume Time
LP0 Mode Resume Time
Input Low Voltage for SRSTN
and All Port Pins
Input High Voltage for SRSTN
and All Port Pins
Input Hysteresis (Schmitt)
Output Low Voltage for All Port
Pins
Output High Voltage for All
Port Pins
Input/Output Pin Capacitance
for All GPIO Port Pins
Pullup Resistance for All GPIO
Port Pins
Input Leakage Current Low
Input Leakage Current High
FLASH MEMORY
Flash Erase Time
Flash Programming Time per
Word
Flash Endurance
Data Retention
LCD
LCD Reference Voltage
LCD Segment/Common Bias
Voltage
V
LCD
V
LCD
output boost voltage;
V
DD
= 2.0V to 3.6V
2/3 level
V
LCDBIAS
1/2 level
1/3 level
LCD_LCRA[3:0] = 0
LCD Adjustment Voltage
V
ADJ
LCD_LCRA[3:0] = 15
Static and 1/3 bias
1/2 bias
LCD_LCRA[3:0] = 15
3.3
V
ADJ
+ 2/3 (V
LCD
- V
ADJ
)
V
ADJ
+ 1/2 (V
LCD
- V
ADJ
)
V
ADJ
+ 1/3 (V
LCD
- V
ADJ
)
0
0.4 ×
V
LCD
108
72
72
V
V
V
t
RET
t
ME
t
ERASE
t
PROG
(Note 5)
T
A
= +25°C (Note 5)
20
100
Mass erase
Page erase
30
30
60
ms
µs
K cycles
Years
SYMBOL
t
ONLP1
t
ONLP0
V
IL
V
IH
V
IHYS
V
OL
V
OH
C
IO
R
PU25K
R
PU1M
I
IL
I
IH
Normal drive mode
Weak pullup enabled
V
IN
= 0V, internal pullup disabled
V
IN
< V
DD
+ 0.6V or 3.6V or whichever
is lower, internal pullup disabled
-100
-100
V
DD
= 3.6V, I
OL
= 11mA
V
DD
= 2.3V, I
OL
= 8mA
I
OH
= -2mA
V
DDIO
− 0.5
5
25
1
+100
+100
0.7×
V
DDIO
300
0.4
0.4
0.5
0.5
CONDITIONS
MIN
TYP
15
26
0.3 ×
V
DDIO
MAX
UNITS
µs
µs
V
V
mV
V
V
pF
kΩ
MΩ
nA
nA
LCD Bias Resistor
LCD Adjustment Resistor
R
LCD
R
LADJ
kΩ
kΩ
www.maximintegrated.com
Maxim Integrated
│
3
MAX32600
Wellness Measurement Microcontroller
Recommended DC Operating Conditions (continued)
(V
DD
= V
RST
to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER
REAL-TIME CLOCK (RTC)
RTC Input Frequency
RTC Operating Current
RTC Initial Power-Up Time
RTC Power Mode Transition
Time from LP0/LP1 to LP2/LP3
f
32KIN
I
RTC
I
RTC_LP0
t
RTC_ PUP
32kHz watch crystal
Micro in LP2 or LP3
Micro in LP0 or LP1
(Note 6)
RTC transition from low to high power
drive, not required in all applications
32.768
0.7
0.4
250
256
kHz
µA
µA
ms
ms
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
USB Electrical Characteristics
(V
DD
= V
RST
to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 5)
PARAMETER
USB Supply Voltage
USB PHY Supply Voltage
V
BUS
Supply Current in LP2/3
While Transmitting USB Data
(Note 3)
V
BUS
Supply Current in LP2/3
with USB Idle
Single-Ended Input High Voltage
D+, D-
Single-Ended Input Low Voltage
D+, D-
Output Low Voltage D+, D-
Output High Voltage D+, D-
Differential Input Sensitivity D+, D-
Common-Mode Voltage Range
Single-Ended Receiver
Threshold
Single-Ended Receiver
Hysteresis
Differential Output Signal
Cross-Point Voltage
D+, D- Off-State Input
Impedance
SYMBOL
V
BUS
V
DDB
V
BUS
≥ 4.0V
Transmitting on D+ and D- at 12Mbps,
C
L
= 50 pF on D+ and D- to V
SS
,
FRCVDD = 0
Transmitting on D+ and D- at 12Mbps,
C
L
= 50 pF on D+ and D- to GND,
FRCVDD = 1
CONDITIONS
MIN
4.5
3.3
3 + I
DD
TYP
MAX
5.5
UNITS
V
V
mA
I
VBUS_TX
3
0.4 +
I
DD
2.0
0.8
mA
mA
V
V
V
V
V
2.5
2.0
V
V
mV
V
kΩ
I
VBUS_IDLE
D+ = hi, D- = lo, FRCVDD = 18
V
IHD
V
ILD
V
OLD
V
OHD
V
DI
V
CM
V
SE
V
SEH
V
CRS
R
LZ
C
L
= 50pF
300
R
L
= 1.5kΩ from D+ to 3.6V
R
L
= 15kΩ from D+ and D- to V
SS
D+ to D-
Includes V
DI
range
2.8
0.2
0.8
0.8
0.3
200
1.65
www.maximintegrated.com
Maxim Integrated
│
4
MAX32600
Wellness Measurement Microcontroller
USB Electrical Characteristics
PARAMETER
Driver Output Impedance
D+ Pullup Resistor
USB TIMING
D+, D- Rise Time (Transmit)
D+, D- Fall Time (Transmit)
Rise/Fall Time Matching
(Transmit)
t
R
t
F
t
R
, t
F
C
L
= 50pF
C
L
= 50pF
C
L
= 50pF
12
12
100
ns
ns
%
SYMBOL
R
DRV
R
PU
Idle
Receiving
CONDITIONS
Steady-state drive
MIN
28
0.9
1.425
TYP
MAX
44
1.575
3.090
UNITS
Ω
kΩ
Clock Electrical Characteristics
(V
DD
= V
RST
to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
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