System Basis Chip with Low Speed Fault Tolerant CAN
MC33389ADH | MC33389ADW | MC33389DDW | MC33389CDH | |
---|---|---|---|---|
描述 | System Basis Chip with Low Speed Fault Tolerant CAN | System Basis Chip with Low Speed Fault Tolerant CAN | System Basis Chip with Low Speed Fault Tolerant CAN | System Basis Chip with Low Speed Fault Tolerant CAN |
厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
包装说明 | - | SOP, SOP28,.4 | SOP, SOP28,.4 | HSOP, SOP20,.56 |
Reach Compliance Code | - | unknown | unknow | unknow |
数据速率 | - | 125 Mbps | 125 Mbps | 125 Mbps |
JESD-30 代码 | - | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G20 |
长度 | - | 17.925 mm | 17.925 mm | 15.9 mm |
功能数量 | - | 1 | 1 | 1 |
端子数量 | - | 28 | 28 | 20 |
收发器数量 | - | 1 | 1 | 1 |
最高工作温度 | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | SOP | HSOP |
封装等效代码 | - | SOP28,.4 | SOP28,.4 | SOP20,.56 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG |
电源 | - | 5.5/18 V | 5.5/18 V | 5.5/18 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.65 mm | 2.65 mm | 3.4 mm |
最大压摆率 | - | 7 mA | 7 mA | 7 mA |
标称供电电压 | - | 12 V | 12 V | 12 V |
表面贴装 | - | YES | YES | YES |
电信集成电路类型 | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | - | GULL WING | GULL WING | GULL WING |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | DUAL |
宽度 | - | 7.5 mm | 7.5 mm | 11 mm |
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