Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> MK22FN512VFX12

MK22FN512VFX12: 产品描述ARM Microcontrollers - MCU Kinetis K22: 120MHz Cortex-M4F Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 88-QFN; 产品类别半导体嵌入式处理器和控制器; 文件大小1MB，共82页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK22FN512VFX12概述

ARM Microcontrollers - MCU Kinetis K22: 120MHz Cortex-M4F Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 88-QFN

MK22FN512VFX12规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	NXP(恩智浦)
产品种类 Product Category	ARM Microcontrollers - MCU
安装风格 Mounting Style	SMD/SMT
Core	ARM Cortex M4
Data Bus Width	32 bit
Maximum Clock Frequency	120 MHz
Program Memory Size	512 kB
Data RAM Size	128 kB
ADC Resolution	16 bit
Number of I/Os	81 I/O
工作电源电压 Operating Supply Voltage	1.71 V to 3.6 V
最大工作温度 Maximum Operating Temperature	+ 105 C
接口类型 Interface Type	I2C, I2S, SPI, UART, USB
产品 Product	MCU+DSP+FPU
Program Memory Type	Flash
Data RAM Type	SRAM
Analog Supply Voltage	1.71 V to 3.6 V
DAC Resolution	12 bit
Development Kit	FRDM-K22F
最小工作温度 Minimum Operating Temperature	- 40 C
Number of ADC Channels	4 Channel
Number of Timers/Counters	2 x 16 bit, 1 x 32 bit
Processor Series	K22
工厂包装数量 Factory Pack Quantity	840
电源电压-最大 Supply Voltage - Max	3.6 V
电源电压-最小 Supply Voltage - Min	1.71 V
看门狗计时器 Watchdog Timers	Watchdog Timer
单位重量 Unit Weight	0.009362 oz

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NXP Semiconductors

Data Sheet: Technical Data

K22P121M120SF7

Rev. 7.1, 08/2016

Kinetis K22F 512KB Flash

120 MHz ARM® Cortex®-M4 Based Microcontroller with FPU

The Kinetis K22 product family members are optimized for cost-

sensitive applications requiring low-power, USB connectivity, and

processing efficiency and high peripheral integration with a

floating point unit. These devices share the comprehensive

enablement and scalability of the Kinetis family.

This product offers:

• Run power consumption down to 156 µA/MHz and static

power consumption down to 3.8 µA, full state retention and

6 µS wakeup. Lowest static mode down to 140 nA.

• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO

voltage regulator. USB FS device crystal-less functionality.

MK22FN512VDC12

MK22FN512VLL12

MK22FN512VLH12

MK22FN512VMP12

MK22FN512VFX12

100 & 64 LQFP(LL&LH)

121 XFBGA (DC)

14x14x1.4 mm P .5(LL)

8 x 8 x 0.5 mm P .65

10x10x1.4 mm P .5(LH)

64 MAPBGA (MP)

5 x 5 x 1.2 mm P .5

88 QFN (FX)

10 x 10 x 0.9 mm P .4

Performance

• 120 MHz ARM Cortex-M4 core with DSP instructions

delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• 512 KB of embedded flash and 128 KB of RAM

• FlexBus external bus interface

• Serial programming interface (EzPort)

• Preprogrammed Kinetis flashloader for one-time, in-

system factory programming

Timers

• Two 8-ch general purpose/PWM timers

• Two 2-ch general purpose timers with quadrature

decoder functionality

• Periodic interrupt timers

• 16-bit low-power timer

• Real-time clock with independent power domain

• Programmable delay block

Security and integrity modules

• Hardware CRC module

• 128-bit unique identification (ID) number per chip

• Hardware random-number generator

• Flash access control to protect proprietary software

Operating Characteristics

• Voltage range (including flash writes): 1.71 to 3.6 V

• Temperature range (ambient): -40 to 105°C

Analog modules

• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)

• Two 12-bit DACs

• Two analog comparators (CMP) with 6-bit DAC

• Accurate internal voltage reference

System peripherals

• Flexible low-power modes, multiple wake-up

sources

• 16-channel DMA controller

• Independent external and software watchdog

monitor

Clocks

• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz

or 3-32 MHz

• Three internal oscillators: 32 kHz, 4 MHz, & 48 MHz

• Multipurpose clock generator with PLL and FLL

Communication interfaces

• USB full/low-speed On-the-Go controller

• USB full-speed device crystal-less operation

• Two SPI modules and I2S module

• Three UART modules and one low-power UART

• Two I2C: Support for up to 1 Mbps operation

Human-machine interface

• Up to 81 general-purpose I/O (GPIO)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 17

2.2.7 Designing with radiated emissions in mind..........18

2.2.8 Capacitance attributes.........................................18

2.3 Switching specifications...................................................18

2.3.1 Device clock specifications..................................18

2.3.2 General switching specifications......................... 19

2.4 Thermal specifications..................................................... 20

2.4.1 Thermal operating requirements......................... 20

2.4.2 Thermal attributes................................................20

2.4.3 Thermal attributes for 88 QFN.............................21

3 Peripheral operating requirements and behaviors.................. 22

3.1 Core modules.................................................................. 22

3.1.1 SWD electricals .................................................. 22

3.1.2 JTAG electricals.................................................. 23

3.2 System modules.............................................................. 26

3.3 Clock modules................................................................. 26

3.3.1 MCG specifications..............................................26

3.3.2

3.3.3

3.3.4

IRC48M specifications.........................................29

Oscillator electrical specifications........................29

32 kHz oscillator electrical characteristics........... 32

3.6 Analog............................................................................. 38

3.6.1 ADC electrical specifications............................... 39

3.6.2 CMP and 6-bit DAC electrical specifications....... 43

3.6.3 12-bit DAC electrical characteristics....................45

3.6.4 Voltage reference electrical specifications.......... 48

3.7 Timers..............................................................................49

3.8 Communication interfaces............................................... 49

3.8.1 USB electrical specifications............................... 50

3.8.2 USB VREG electrical specifications.................... 50

3.8.3 DSPI switching specifications (limited voltage

range).................................................................. 51

3.8.4 DSPI switching specifications (full voltage

range).................................................................. 53

3.8.5 Inter-Integrated Circuit Interface (I2C) timing...... 54

3.8.6 UART switching specifications............................ 56

3.8.7 I2S/SAI switching specifications.......................... 56

4 Dimensions............................................................................. 62

4.1 Obtaining package dimensions....................................... 62

5 Pinout...................................................................................... 63

5.1 K22F Signal Multiplexing and Pin Assignments.............. 63

5.2 Recommended connection for unused analog and

digital pins........................................................................69

5.3 K22 Pinouts..................................................................... 70

6 Part identification.....................................................................75

6.1 Description.......................................................................75

6.2 Format............................................................................. 75

6.3 Fields............................................................................... 76

6.4 Example...........................................................................76

6.5 121-pin XFBGA part marking.......................................... 77

6.6 64-pin MAPBGA part marking......................................... 77

7 Terminology and guidelines.................................................... 77

7.1 Definitions........................................................................ 77

7.2 Examples......................................................................... 78

7.3 Typical-value conditions.................................................. 78

7.4 Relationship between ratings and operating

requirements....................................................................79

7.5 Guidelines for ratings and operating requirements..........79

8 Revision History...................................................................... 79

3.4 Memories and memory interfaces................................... 32

3.4.1 Flash electrical specifications.............................. 32

3.4.2 EzPort switching specifications........................... 34

3.4.3 Flexbus switching specifications..........................35

3.5 Security and integrity modules........................................ 38