BAS21H, NSVBAS21H
High Voltage
Switching Diode
Features
•
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•
These are Pb−Free Devices
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Repetitive Peak Reverse Voltage
Peak Forward Current
Repetitive Peak Forward Current
Non−Repetitive Peak Forward Surge
Current, 60 Hz
Non−Repetitive Peak Forward Current
(Square Wave, T
J
= 25°C prior to
surge)
t = 1
ms
t = 10
ms
t = 100
ms
t = 1 ms
t=1s
Symbol
V
R
V
RRM
I
F
I
FRM
I
FSM(surge)
I
FSM
20
20
10
4
1
Value
250
250
200
500
2.5
Unit
V
V
mA
mA
A
2
A
1
SOD−323
CASE 477
STYLE 1
JS M
G
G
1
CATHODE
2
ANODE
www.onsemi.com
HIGH VOLTAGE
SWITCHING DIODE
MARKING
DIAGRAM
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) T
A
= 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Range
Symbol
P
D
Max
200
1.57
R
qJA
T
J
, T
stg
635
−55 to
+150
Unit
mW
mW/°C
°C/W
JS
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
ORDERING INFORMATION
°C
Device
BAS21HT1G,
NSVBAS21HT1G
BAS21HT3G,
NSVBAS21HT3G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping
†
3000 / Tape & Reel
10000 / Tape &
Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 Minimum Pad
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
1
September, 2017 − Rev. 12
Publication Order Number:
BAS21HT1/D
BAS21H, NSVBAS21H
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
H
E
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1
0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C
0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
H
E
2.30
2.50
2.70
STYLE 1:
PIN 1. CATHODE
2. ANODE
MIN
0.031
0.000
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
b
1
2
E
A3
A
L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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