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24AA16-I-SNG

产品描述EEPROM 2kx8 - 1.8V Lead Free Package
产品类别存储   
文件大小223KB,共25页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
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24AA16-I-SNG概述

EEPROM 2kx8 - 1.8V Lead Free Package

24AA16-I-SNG规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Microchip(微芯科技)
产品种类
Product Category
EEPROM
RoHSDetails
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SOIC-8
Memory Size16 kbit
Organization2 k x 8
接口类型
Interface Type
Serial, 2-Wire, I2C
Access Time900 ns
Data Retention200 Year
Maximum Clock Frequency0.4 MHz
Supply Current - Max5 mA
工作电源电压
Operating Supply Voltage
1.8 V, 5.5 V
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
高度
Height
1.25 mm (Min)
长度
Length
4.9 mm
宽度
Width
3.9 mm
工作电源电流
Operating Supply Current
3 mA
Programming Voltage1.7 V to 5.5 V
工厂包装数量
Factory Pack Quantity
100
电源电压-最大
Supply Voltage - Max
5.5 V
电源电压-最小
Supply Voltage - Min
1.7 V
单位重量
Unit Weight
0.019048 oz

文档预览

下载PDF文档
24AA16/24LC16B
16K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA16
24LC16B
Note 1:
Vcc
Range
1.8-5.5
2.5-5.5
Max Clock
Frequency
400 kHz
(1)
400 kHz
Temp
Ranges
I
I, E
Description
The Microchip Technology Inc. 24AA16/24LC16B
(24XX16*) is a 16 Kbit Electrically Erasable PROM.
The device is organized as eight blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.8V with standby
and active currents of only 1
µA
and 1 mA,
respectively. The 24XX16 also has a page write
capability for up to 16 bytes of data. The 24XX16 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP and MSOP packages and is also avail-
able in the 5-lead SOT-23 package.
100 kHz for V
CC
<2.5V
Features
• Single supply with operation down to 1.8V
• Low-power CMOS technology
- 1 mA active current typical
- 1
µA
standby current (max.) (I-temp)
• Organized as 8 blocks of 256 bytes (8 x 256 x 8)
• 2-wire serial interface bus, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (2.5V) and 400 kHz (≥2.5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 16 bytes
• 2 ms typical write cycle time for page write
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• 5-lead SOT-23 package
• Standard and Pb-free finishes available
• Available temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Package Types
PDIP/SOIC/TSSOP/MSOP
A0
A1
A2
Vss
1
8
Vcc
WP
SCL
SCL
Vss
1
2
3
SOT-23-5
5
WP
24XX16
24XX16
2
3
4
7
6
5
SDA SDA
4
Vcc
Note:
Pins A0, A1 and A2 are not used by the
24LC16B. (No internal connections).
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SDA
SCL
YDEC
V
CC
V
SS
Sense Amp.
R/W Control
*24XX16 is used in this document as a generic part number for the 24AA16/24LC16B devices.
2003 Microchip Technology Inc.
DS21703D-page 1

24AA16-I-SNG相似产品对比

24AA16-I-SNG 24LC16BT-I-STG 24AA16T-I/MSG 24AA16T-I/STG 24LC16B-I/MSG 24AA16T-I/OTG 24AA16-I/STG 24AA16T/SN
描述 EEPROM 2kx8 - 1.8V Lead Free Package EEPROM 2kx8 - 2.5V Lead Free Package EEPROM 2kx8 - 1.8V Lead Free Package EEPROM 2kx8 - 1.8V Lead Free Package EEPROM 2kx8 - 2.5V Lead Free Package EEPROM 2kx8 - 1.8V Lead Free Package 电可擦除可编程只读存储器 2kx8 - 1.8V Lead Free Package 电可擦除可编程只读存储器 2kx8 - 1.8V
是否无铅 - - 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 - - 符合 符合 符合 符合 符合 符合
零件包装代码 - - TSSOP TSSOP TSSOP SOT-23 TSSOP SOIC
包装说明 - - TSSOP, TSSOP8,.19 TSSOP, TSSOP8,.25 ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8 LSSOP, TSOP5/6,.11,37 TSSOP, TSSOP8,.25 SOP, SOP8,.25
针数 - - 8 8 8 5 8 8
Reach Compliance Code - - compliant compliant compliant compliant compliant compliant
ECCN代码 - - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 - - 1 MILLION ERASE/WRITE CYCLES 1 MILLION ERASE/WRITE CYCLES 1 MILLION ERASE/WRITE CYCLES 1 MILLION ERASE/WRITE CYCLES 1 MILLION ERASE/WRITE CYCLES 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED
最大时钟频率 (fCLK) - - 0.1 MHz 0.1 MHz 0.4 MHz 0.1 MHz 0.1 MHz 0.1 MHz
数据保留时间-最小值 - - 200 200 200 200 200 200
耐久性 - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 - - 1010MMMR 1010MMMR 1010MMMR 1010MMMR 1010MMMR 1010MMMR
JESD-30 代码 - - S-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDSO-G5 R-PDSO-G8 R-PDSO-G8
JESD-609代码 - - e3 e3 e3 e3 e3 e3
长度 - - 3 mm 4.4 mm 3 mm 2.95 mm 4.4 mm 4.9 mm
内存密度 - - 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
内存集成电路类型 - - EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 - - 8 8 8 8 8 8
湿度敏感等级 - - 1 1 1 1 1 1
功能数量 - - 1 1 1 1 1 1
端子数量 - - 8 8 8 5 8 8
字数 - - 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 - - 2000 2000 2000 2000 2000 2000
工作模式 - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 - - 85 °C 85 °C 85 °C 85 °C 85 °C 70 °C
最低工作温度 - - -40 °C -40 °C -40 °C -40 °C -40 °C -
组织 - - 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
封装主体材料 - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - - TSSOP TSSOP TSSOP LSSOP TSSOP SOP
封装等效代码 - - TSSOP8,.19 TSSOP8,.25 TSSOP8,.19 TSOP5/6,.11,37 TSSOP8,.25 SOP8,.25
封装形状 - - SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
并行/串行 - - SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) - - 260 260 260 260 260 260
电源 - - 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - - 1.1 mm 1.1 mm 1.1 mm 1.45 mm 1.1 mm 1.75 mm
串行总线类型 - - I2C I2C I2C I2C I2C I2C
最大待机电流 - - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.00003 A
最大压摆率 - - 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
最大供电电压 (Vsup) - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - - 1.7 V 1.7 V 2.5 V 1.7 V 1.7 V 1.8 V
标称供电电压 (Vsup) - - 2.5 V 2.5 V 5 V 2.5 V 2.5 V 3 V
表面贴装 - - YES YES YES YES YES YES
技术 - - CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 - - GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 - - 0.65 mm 0.65 mm 0.65 mm 0.95 mm 0.65 mm 1.27 mm
端子位置 - - DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 - - 40 40 40 40 40 40
宽度 - - 3 mm 3 mm 3 mm 1.63 mm 3 mm 3.9 mm
最长写入周期时间 (tWC) - - 5 ms 5 ms 5 ms 5 ms 5 ms 10 ms
写保护 - - HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches - - 1 1 1 1 1 1
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