Encoders, Decoders, Multiplexers & Demultiplexers 5V Quad 2-Channel
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ON Semiconductor(安森美) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP16,.3 |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | AHCT/VHCT |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e4 |
长度 | 10.2 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.008 A |
湿度敏感等级 | 3 |
功能数量 | 4 |
输入次数 | 2 |
输出次数 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | RAIL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 9.5 ns |
传播延迟(tpd) | 11 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.05 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 5.275 mm |
Base Number Matches | 1 |
MC74VHCT157AM | MC74VHCT157ADT | MC74VHCT157ADR2 | MC74VHCT157ADTR2 | MC74VHCT157AMEL | MC74VHCT157AD | |
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描述 | Encoders, Decoders, Multiplexers & Demultiplexers 5V Quad 2-Channel | Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS QUAD 2-CHAN MULT | Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS QUAD 2-CHAN MULT | Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS QUAD 2-CHAN MULT | Encoders, Decoders, Multiplexers & Demultiplexers 5V Quad 2-Channel | Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS QUAD 2-CHAN MULT |
是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
零件包装代码 | SOIC | TSSOP | SOIC | TSSOP | SOIC | SOIC |
包装说明 | SOP, SOP16,.3 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | SOP, SOP16,.3 | SOP, SOP16,.25 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | not_compliant | unknown | unknown | not_compliant |
系列 | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e4 | e4 | e0 | e4 | e4 | e0 |
长度 | 10.2 mm | 5 mm | 9.9 mm | 5 mm | 10.2 mm | 9.9 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
最大I(ol) | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
湿度敏感等级 | 3 | 1 | 1 | 1 | 3 | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
输出次数 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSSOP | SOP | TSSOP | SOP | SOP |
封装等效代码 | SOP16,.3 | TSSOP16,.25 | SOP16,.25 | TSSOP16,.25 | SOP16,.3 | SOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
包装方法 | RAIL | RAIL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | RAIL |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 240 | 260 | NOT SPECIFIED | 240 |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
传播延迟(tpd) | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.05 mm | 1.2 mm | 1.75 mm | 1.2 mm | 2.05 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | 30 | 40 | NOT SPECIFIED | 30 |
宽度 | 5.275 mm | 4.4 mm | 3.9 mm | 4.4 mm | 5.275 mm | 3.9 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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