The Schottky Power Rectifier employs the Schottky Barrier
principle with a barrier metal that produces optimal forward voltage
drop−reverse current tradeoff. Ideally suited for low voltage, high
frequency rectification, or as a free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package provides an alternative to the
leadless 34 MELF style package.
Features
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SCHOTTKY BARRIER
RECTIFIER
0.5 AMPERES, 40 VOLTS
Guardring for Stress Protection
Very Low Forward Voltage
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
AEC−Q101 Qualified and PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics
SOD−123
CASE 425
STYLE 1
MARKING DIAGRAM
1
B4MG
G
Device Marking: B4
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C max. for 10 Seconds
ESD Rating:
Human Body Model = 3B
Machine Model = C
B4
M
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBR0540T1G
Package
SOD−123
(Pb−Free)
Shipping
†
3,000/Tape & Reel
(8 mm Tape, 7” Real)
3,000/Tape & Reel
(8 mm Tape, 7” Real)
NRVB0540T1G SOD−123
(Pb−Free)
MBR0540T3G
SOD−123 10,000/Tape & Reel
(Pb−Free) (8 mm Tape, 13” Real)
NRVB0540T3G SOD−123 10,000/Tape & Reel
(Pb−Free) (8 mm Tape, 13” Real)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
January, 2012
−
Rev. 7
1
Publication Order Number:
MBR0540T1/D
MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated V
R
, T
C
= 115C)
Peak Repetitive Forward Current
(At Rated V
R
, Square Wave, 20 kHz, T
C
= 115C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature Range
Operating Junction Temperature
Voltage Rate of Change
(Rated V
R
, T
J
= 25C)
Symbol
V
RRM
V
RWM
V
R
I
O
I
FRM
I
FSM
T
stg
, T
C
T
J
dv/dt
Value
40
Unit
V
0.5
1.0
5.5
−55
to +150
−55
to +150
1000
A
A
A
C
C
V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
−
Junction−to−Lead (Note 1)
Thermal Resistance
−
Junction−to−Ambient (Note 2)
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board.
Symbol
R
tjl
R
tja
Value
118
206
Unit
C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(i
F
= 0.5 A)
(i
F
= 1 A)
Maximum Instantaneous Reverse Current (Note 3)
(V
R
= 40 V)
(V
R
= 20 V)
3. Pulse Test: Pulse Width
250
ms,
Duty Cycle
2.0%.
I
R
Symbol
v
F
T
J
= 25C
0.51
0.62
T
J
= 25C
20
10
Value
T
J
= 100C
0.46
0.61
T
J
= 100C
13,000
5,000
mA
Unit
V
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
10
100
10
25C
1.0
T
J
= 125C
T
J
= -40C
T
J
= 25C
T
J
= 100C
0.1
0.2
0.4
0.6
0.8
1.0
1.2
v
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
1.0
T
J
= 125C
T
J
= 100C
T
J
= 25C
0.1
0.2
0.4
0.6
0.8
1.0
1.2
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
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2
Figure 2. Maximum Forward Voltage
MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G
I R, MAXIMUM REVERSE CURRENT (AMPS)
100E-3
I R, REVERSE CURRENT (AMPS)
10E-3
1.0E-3
T
J
= 125C
100E-3
10E-3
1.0E-3
T
J
= 100C
100E-6
T
J
= 100C
10E-6
1.0E-6
T
J
= 25C
0
10
20
30
V
R
, REVERSE VOLTAGE (VOLTS)
40
100E-6
10E-6
T
J
= 25C
1.0E-6
100E-9
100E-9
0
10
20
30
V
R
, REVERSE VOLTAGE (VOLTS)
40
Figure 3. Typical Reverse Current
PFO , AVERAGE POWER DISSIPATION (WATTS)
0.8
I O , AVERAGE FORWARD CURRENT (AMPS)
dc
0.7
FREQ = 20 kHz
0.6
0.5
0.4
0.3
I
pk
/I
o
= 10
0.2
0.1
0
0
20
40
60
80
100
120
140
T
L
, LEAD TEMPERATURE (C)
I
pk
/I
o
= 20
SQUARE WAVE
I
pk
/I
o
=
p
I
pk
/I
o
= 5
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
Figure 4. Maximum Reverse Current
SQUARE WAVE
I
pk
/I
o
=
p
I
pk
/I
o
= 5
I
pk
/I
o
= 10
I
pk
/I
o
= 20
dc
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
TJ , DERATED OPERATING TEMPERATURE (
C)
100
T
J
= 25C
C, CAPACITANCE (pF)
126
124
Figure 6. Forward Power Dissipation
R
tja
= 118C/W
122
120
118
149C/W
116
114
206C/W
112
228C/W
110
0
5.0
10
15
20
25
30
35
40
V
R
, DC REVERSE VOLTAGE (VOLTS)
180C/W
10
0
5.0
10
15
20
25
30
35
40
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any
reverse voltage conditions. Calculations of T
J
therefore must include forward and reverse power effects. The allowable operating
T
J
= T
Jmax
−
r(t)(Pf + Pr) where
T
J
may be calculated from the equation:
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T
J
due to reverse bias under DC conditions only and is calculated as
T
J
= T
Jmax
−
r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed.
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3
MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1E+00
50%
20%
10%
1E-01
5.0%
2.0%
1.0%
1E-02
Rtjl(t) = Rtjl*r(t)
1E-03
0.00001
0.0001
0.001
0.01
0.1
T, TIME (s)
1.0
10
100
1,000
Figure 9. Thermal Response Junction to Lead
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1E+00
50%
20%
1E-01
10%
5.0%
2.0%
1E-02
1.0%
Rtjl(t) = Rtjl*r(t)
1E-03
0.00001
0.0001
0.001
0.01
0.1
T, TIME (s)
1.0
10
100
1,000
Figure 10. Thermal Response Junction to Ambient
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4
MBR0540T1G, NRVB0540T1G, MBR0540T3G, NRVB0540T3G
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
A
A1
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
c
D
E
H
E
L
q
MILLIMETERS
MIN
NOM
MAX
0.94
1.17
1.35
0.00
0.05
0.10
0.51
0.61
0.71
---
---
0.15
1.40
1.60
1.80
2.54
2.69
2.84
3.56
3.68
3.86
---
---
0.25
---
10
0
MIN
0.037
0.000
0.020
---
0.055
0.100
0.140
0.010
0
INCHES
NOM
0.046
0.002
0.024
---
0.063
0.106
0.145
---
---
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
---
10
H
E
2.36
0.093
4.19
0.165
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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