Laser Drivers 20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | TSSOP |
| 包装说明 | HTSSOP, TSSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HTSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| MAX3289CUE | MAX3296CTI+ | MAX3286CHJ-T | MAX3288CUE-T | MAX3289CUE-T | MAX3296C-D | MAX3287CUE-T | MAX3286C/D | MAX3286CTI+ | MAX3297CUE+T | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Laser Drivers 20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters | 激光驱动器 IC lsr dvr 2.5gbps | Laser Drivers | Laser Drivers | Laser Drivers 20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters | Laser Drivers 3.0V to 5.5V, 1.25Gbps/2.5Gbps LAN Laser Drivers | Laser Drivers | Laser Drivers DICE SALES, DICE | IC LSR DVR LAN 1.25GBPS 28-TQFN | IC LSR DVR 2.5GBPS 16TSSOP |
| 是否无铅 | 含铅 | - | - | 含铅 | 含铅 | - | 含铅 | 含铅 | 不含铅 | - |
| 是否Rohs认证 | 不符合 | 符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | TSSOP | QFN | - | TSSOP | TSSOP | - | TSSOP | DIE | QFN | TSSOP |
| 包装说明 | HTSSOP, TSSOP16,.25 | 5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WHHD-1, TQFN-28 | - | HTSSOP, TSSOP16,.25 | HTSSOP, TSSOP16,.25 | - | HTSSOP, TSSOP16,.25 | DIE-29 | HVQCCN, LCC28,.2SQ,20 | 4.40 MM, 0.65 MM PITCH, MO-153AB, TSSOP-16 |
| 针数 | 16 | 28 | - | 16 | 16 | - | 16 | 29 | 28 | 16 |
| Reach Compliance Code | not_compliant | unknow | - | not_compliant | not_compliant | - | not_compliant | not_compliant | compliant | compliant |
| 接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XDSO-G16 | S-XQCC-N28 | - | R-XDSO-G16 | R-XDSO-G16 | - | R-XDSO-G16 | R-XUUC-N28 | - | R-PDSO-G16 |
| JESD-609代码 | e0 | e3 | - | e0 | e0 | - | e0 | e0 | - | e3 |
| 长度 | 5 mm | 5 mm | - | 5 mm | 5 mm | - | 5 mm | - | - | 5 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | 1 | 1 | - | 1 | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | 16 | 28 | - | 16 | 16 | - | 16 | 28 | - | 16 |
| 最高工作温度 | 70 °C | 70 °C | - | 70 °C | 70 °C | - | 70 °C | 70 °C | - | 70 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | HVQCCN | - | HTSSOP | HTSSOP | - | HTSSOP | DIE | - | TSSOP |
| 封装等效代码 | TSSOP16,.25 | LCC28,.2SQ,20 | - | TSSOP16,.25 | TSSOP16,.25 | - | TSSOP16,.25 | - | - | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | UNCASED CHIP | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 260 | - | 245 | 245 | - | 240 | 240 | - | 260 |
| 电源 | 3.3/5 V | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | - | 3.3/5 V | - | - | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.1 mm | 0.8 mm | - | 1.1 mm | 1.1 mm | - | 1.1 mm | - | - | 1.1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 | 3 V | 3 V | - | 3 V | 3 V | - | 3 V | 3 V | - | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | YES | - | YES | YES | - | YES | YES | - | YES |
| 技术 | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR | - | BIPOLAR | - | - | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) | TIN LEAD | - | Matte Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | - | GULL WING | GULL WING | - | GULL WING | NO LEAD | - | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | - | 0.65 mm | 0.65 mm | - | 0.65 mm | - | - | 0.65 mm |
| 端子位置 | DUAL | QUAD | - | DUAL | DUAL | - | DUAL | UPPER | - | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 30 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 4.4 mm | 5 mm | - | 4.4 mm | 4.4 mm | - | 4.4 mm | - | - | 4.4 mm |
| 厂商名称 | - | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
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