REVISIONS
LTR
A
DESCRIPTION
Add vendor CAGE numbers 01295, 18324, and 34335 to the drawing. Added
device types 05 and 06 for vendor CAGE number 34335. Change to absolute
maximum ratings and table I. Editorial changes throughout.
Add device types 11 through 18 for vendor CAGE 34335. Removed vendor
CAGE 18324 as a source of supply for device types 05 and 06. Add vendor
CAGE 01295 to device types 15 through 18, packages L, K, and 3. Editorial
changes throughout.
Changes to table I; conditions for IIH, limits on ICC, and limits on some timing
conditions. Change pin 16 on case outline 3 to
OE . Add device type 19.
Editorial changes throughout.
DATE (YR-MO-DA)
90-03-29
APPROVED
M. Frye
B
91-05-09
M. Frye
C
93-02-19
M. Frye
D
E
Changes in accordance with NOR 5962-R142-93
Update drawing to current requirements. Editorial changes throughout. - gap
93-04-21
02-01-07
M. Frye
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
E
18
REV
SHEET
PREPARED BY
Kenneth Rice
E
19
E
20
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
E
12
E
13
E
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Kenneth Rice
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
87-09-20
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL,
MEMORY, BIPOLAR,
PROGRAMMING LOGIC,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
E
SIZE
A
SHEET
CAGE CODE
67268
1 OF
20
5962-87671
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E154-02
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87671
01
K
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
Generic number
PAL20L8B
PAL20R8B
PAL20R6B
PAL20R4B
PLUS20L8
PLUS20R8
PAL20L8-15
PAL20R8-15
PAL20R6-15
PAL20R4-15
PAL20L8-12
PAL20R8-12
PAL20R6-12
PAL20R4-12
PAL20L8-10
PAL20R8-10
PAL20R6-10
PAL20R4-10
PAL20R8-7
Circuit function
20-input 8-output AND-OR invert gate array
20-input 8-output registered AND-OR gate array
20-input 6-output registered AND-OR gate array
20-input 4-output registered AND-OR gate array
20-input 8-output AND-OR invert gate array
20-input 8-output registered AND-OR gate array
20-input 8-output AND-OR invert gate array
20-input 8-output registered AND-OR gate array
20-input 6-output registered AND-OR gate array
20-input 4-output registered AND-OR gate array
20-input 8-output AND-OR invert gate array
20-input 8-output registered AND-OR gate array
20-input 6-output registered AND-OR gate array
20-input 4-output registered AND-OR gate array
20-input 8-output AND-OR invert gate array
20-input 8-output registered AND-OR gate array
20-input 6-output registered AND-OR gate array
20-input 4-output registered AND-OR gate array
20-input 8-output registered AND-OR gate array
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
K
L
3
Descriptive designator
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N28
Terminals
24
24
28
Package style
Flat pack
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87861
SHEET
E
2
1.3 Absolute maximum ratings.
Supply voltage range ..........................................................
Input voltage range .............................................................
Storage temperature range .................................................
Lead temperature (soldering, 10 seconds) .........................
Thermal resistance, junction-to-case (θ
JC
) 1/ ....................
Output voltage applied .......................................................
Output sink current .............................................................
Maximum power dissipation (P
D
) 2/ ....................................
Maximum junction temperature (T
J
) ...................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ................................................
Minimum high level input voltage (V
IH
) ...............................
Maximum low level input voltage (V
IL
) ................................
Case operating temperature range (T
C
) .............................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.8 V dc
-55°C to +125°C
-0.5 V dc to +7 V dc
-1.5 V dc at -18 mA to +5.5 V
-65°C to +150°C
+260°C
See MIL-STD-1835
5.5 V dc
100 mA
1.2 W
+175°C
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
_______
1/ Heat sinking is recommended to reduce the junction temperature.
2/ Must withstand the added P
D
due to short circuit test (e.g., I
OS
).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87861
SHEET
E
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, or C (see 4.4), the devices shall be programmed by the
manufacturer prior to test with a minimum of 50 percent of the total number of gates programmed or to any altered item
drawing pattern which includes at least 25 percent of the total number of gates programmed.
3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered drawing.
3.2.4 Logic diagram. The logic diagram for unprogrammed devices shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87861
SHEET
E
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
C
≤
+125°C
4.5 V
≤
V
CC
≤
5.5 V
unless otherwise specified
V
CC
= 4.5 V, II = -18 mA
V
CC
= 4.5 V, V
IL
≤
0.8 V,
V
IH
≥
2.0 V, I
OH
= -2 mA
V
CC
= 4.5 V, V
IL
≤
0.8 V,
V
IH
≥
2.0 V, I
OL
= 12 mA
V
CC
= 5.5 V 2/
V
CC
= 5.5 V 2/
V
CC
= 5.5 V,
OE
Test
Symbol
Group A
subgroups
1
1, 2, 3
1, 2
3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
Device
type
Min
All
01-18
19
19
All
All
All
All
2.4
2.4
2.3
Limits
Max
-1.5
Unit
Input clamp
voltage
High level output
voltage
Low level output
voltage
High level input
voltage
Low level input
voltage
High level input
current
V
IC
V
OH
V
V
V
OL
V
IH
V
IL
I
IH
0.5
2.0
0.8
40
25
V
V
V
µA
Low level input
current
Output short
circuit current
I
IL
I
OS
V
I
= 2.4 V, 3/
all other pins =
others
0.0 V
V
CC
= 5.5 V, V
I
= 0.4 V 3/
V
CC
= 5.5 V, V
O
= 0.5 V 4/
V
IH
≥
2.0 V, V
IL
≤
0.8 V
1, 2, 3
1, 2, 3
All
01, 02,
03, 04,
07, 08,
09, 10,
11, 12,
13, 14,
15, 16,
17, 18
05, 06
19
All
All
All
01-14
15-19
-30
-0.25
-250
mA
mA
-30
-30
Input current
Off-state output
current
Off-state output
current
Supply current
I
I
I
OZL
I
OZH
I
CC
V
CC
= 5.5 V, V
I
= 5.5 V
V
CC
= 5.5 V, V
IL
≤
0.8 V
V
IH
≥
2.0 V, V
O
= 0.4 V 3/
V
CC
= 5.5 V, V
IL
≤
0.8 V
V
IH
≥
2.0 V, V
O
= 2.4 V 3/
V
CC
= 5.5 V
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
-90
-130
1.0
-250
100
210
220
mA
µA
µA
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87861
SHEET
E
5
无线连接
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
