EMIF06-mSD02C3
Mini and micro-SD card IPAD™
EMI filtering and ESD protection
Features
■
■
■
■
■
■
■
■
■
■
EMI low-pass filter
ESD protection ±15 kV (IEC 61000-4-2)
Integrated pull up resistors to prevent bus
floating when no card is connected
50 MHz clock frequency compatibility with
C
line
< 20 pF
Low power consumption
Easy layout thanks to smart pin-out
configuration
Very low PCB space consuming
High reliability offered by monolithic integration
A
Flip Chip
(16 bumps)
Figure 1.
Pin configuration (bump side)
4
3
2
1
Reduction of parasitic elements thanks to CSP
integration
Lead-free package
B
C
D
Complies with the following standards:
■
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3A
SD Specification Part 1, Physical Layer
Specification, Version 2.0
Description
The EMIF06-mSD02C3 is a highly integrated
device based on IPAD technology offering two
functions: ESD protection to comply with IEC
standard, and EMI filtering to reject mobile phone
frequencies.
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■
Application
Mini and micro (T-Flash) secure digital memory
card in:
■
■
Mobile phones
Communication systems
TM: IPAD is a trademark of STMicroelectronics
August 2010
Doc ID 16910 Rev 1
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www.st.com
11
Characteristics
EMIF06-mSD02C3
1
Characteristics
Table 1.
Symbol
V
PP
V
in
T
j
T
op
T
stg
Absolute ratings (limiting values)
Parameter
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
Maximum input voltage
Maximum junction temperature
Operating temperature range
Storage temperature range
Value
15
15
5.5
125
- 40 to + 85
- 55 to + 150
Unit
kV
V
°C
°C
°C
Figure 2.
EMIF06-mSD02C3 configuration
Vcc
R10
R11
R12
R13
R9
Clk
CMD
HOST
Data0
Data1
Data2
Data3/CD
R1
R2
R3
R3
R5
R5
SDClk
SDCMD
SDData0
CARD
SDData1
SDData2
SDData3/CD
GND bumps must be connected together
Table 2.
Pin
A1
A2
A3
A4
B1
B2
B3
B4
Pin configuration
Signal
DATA0
DATA1
SDDATA1
SDDATA0
CLK
V
cc
V
ss
SDCLK
Pin
C1
C2
C3
C4
D1
D2
D3
D4
Signal
CMD
V
ss
V
ss
SDCMD
DATA3/CD
DATA2
SDDATA2
SDDATA3/CD
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Doc ID 16910 Rev 1
EMIF06-mSD02C3
Table 3.
Electrical characteristic
Symbol
V
BR
I
RM
R1, R2, R3, R4, R5, R6
R10, R11, R12, R13
R9
C
line
I
R
= 1 mA
V
RM
= 3 V
Tolerance ± 20 %
Tolerance ± 30 %
Tolerance ± 30 %
V = 0 V, F = 1 MHz, V
OSC
= 30 mV
40
56
4.7
15
Test conditions
Min.
14
Typ.
16
Characteristics
Max.
Unit
V
0.1
µA
Ω
kΩ
kΩ
20
pF
Figure 3.
0.00
-
10.00
-
20.00
-
30.00
S21 attenuation measurements
Figure 4.
dB
Analog crosstalk measurements
dB
0.00
-
10.00
-
20.00
-
30.00
-
40.00
-
40.00
-
50.00
V
BIAS
=0 V
-
50.00
-
60.00
F (Hz)
1.0M
DATA0
DATA2
CMD
10.0M
100.0M
DATA1
DATA3/CD
Clk
1.0G
-
70.00
-
80.00
V
BIAS
=0 V
-
60.00
100.0k
100.0k
1.0M
DATA0-SDDATA1
F (Hz)
10.0M
100.0M
DATA0-SDDATA3
1.0G
Figure 5.
ESD response to IEC 61000-4-2
(+15 kV air discharge) on CLK and
data lines
Figure 6.
ESD response to IEC 61000-4-2
(-15 kV air discharge) on CLK and
data lines
20 V/div
Input
20 V/div
Input
5 V/div
Output
10 V/div
100 ns/div
Output
100 ns/div
Doc ID 16910 Rev 1
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Characteristics
EMIF06-mSD02C3
Figure 7.
ESD response to IEC 61000-4-2
(+15 kV air discharge) on V
CC
line
Figure 8.
ESD response to IEC 61000-4-2
(-15 kV air discharge) on V
CC
line
10 V/div
10 V/div
V
CL
V
CL
100 ns/div
100 ns/div
Figure 9.
Digital crosstalk test setup
LeCroy Wavesurfer 64Xs
600 MHz – 2.5Gs/s Oscilloscope
Agilent pulse pattern
generator 81110A
Direct input on 50Ω
Voltage Probe LeCroy
HFP1000
100 k
Ω
/ 0.7 pF
V
OUT
=3 V
t
R
=t
F
=2 ns (open)
F=8.3 MHz
Input Line “A”
Output line “B”
Input Line “B”: 50
Ω
& Open
50Ω
50
•
T
AMB
=25 °C
Figure 10.
Digital crosstalk
100 mV/div
Clk
SDData0
1 V/div
100 ns/div
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Doc ID 16910 Rev 1
EMIF06-mSD02C3
Figure 11.
Step response test setup
Characteristics
LeCroy WavePro 7300A
3 GHz – 20 Gs/s Oscilloscope
Agilent pulse pattern
generator 81110A
V
OUT
=3 V
t
R
=t
F
=2 ns
(values set in open)
F=8.3 MHz
Voltage probe LeCroy
HFP1000
(100 kΩ - 0.7 pF)
Input Line “A”
C
LOAD
=15 pF
Output Line “A”
Notes:
-
Voltage amplitude set to 3V
-
Total capacitance load 15 pF
(5 pF for PCB parasitic capacitance and voltage probe capacitance, 10 pF for Sdcard)
•
Figure 12.
T
AMB
=25 °C
Step response without the filter
1 V/div
SDDatax/CMD/Clk
rise@lv = 885 ps, fall@lv = 886 ps
20% - 70% (SD standard)
C
LOAD
= 15 pF
F = 52 MHz
V = 3V
5 ns/div
Figure 13.
Step response with the filter
1 V/div
SDDatax/CMD/Clk
rise@lv = 1.705 ns, fall@lv = 2.426 ns
20% - 70% (SD standard)
C
LOAD
= 15 pF
F = 52 MHz
V = 3V
5 ns/div
Doc ID 16910 Rev 1
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