SRAM Module, 128KX32, 45ns, CMOS, CQFP68,
参数名称 | 属性值 |
包装说明 | QFP, QFP68,1.1SQ,50 |
Reach Compliance Code | unknown |
最长访问时间 | 45 ns |
I/O 类型 | COMMON |
JESD-30 代码 | S-XQFP-G68 |
内存密度 | 4194304 bit |
内存集成电路类型 | SRAM MODULE |
内存宽度 | 32 |
端子数量 | 68 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 128KX32 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | QFP |
封装等效代码 | QFP68,1.1SQ,50 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
最大待机电流 | 0.0116 A |
最小待机电流 | 2 V |
最大压摆率 | 0.6 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
5962-9559506HMC | 5962-9559505HMC | 5962-9559506HXC | 5962-9559507HMC | 5962-9559507HXC | 5962-9559509HMC | |
---|---|---|---|---|---|---|
描述 | SRAM Module, 128KX32, 45ns, CMOS, CQFP68, | SRAM Module, 128KX32, 55ns, CMOS, CQFP68, | SRAM Module, 128KX32, 45ns, CMOS, CQFP68, | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, | SRAM Module, 128KX32, 35ns, CMOS, CQFP68, | SRAM Module, 128KX32, 20ns, CMOS, CQFP68, |
包装说明 | QFP, QFP68,1.1SQ,50 | QFP, QFP68,1.1SQ,50 | QFF, QFL68,1.56SQ | QFP, QFP68,1.1SQ,50 | QFF, QFL68,1.56SQ | QFP, QFP68,1.1SQ,50 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 45 ns | 55 ns | 45 ns | 35 ns | 35 ns | 20 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-XQFP-G68 | S-XQFP-G68 | S-XQFP-F68 | S-XQFP-G68 | S-XQFP-F68 | S-XQFP-G68 |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | QFP | QFP | QFF | QFP | QFF | QFP |
封装等效代码 | QFP68,1.1SQ,50 | QFP68,1.1SQ,50 | QFL68,1.56SQ | QFP68,1.1SQ,50 | QFL68,1.56SQ | QFP68,1.1SQ,50 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
最大待机电流 | 0.0116 A | 0.0116 A | 0.0116 A | 0.0116 A | 0.0116 A | 0.0116 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | GULL WING | GULL WING | FLAT | GULL WING | FLAT | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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