
TMS570LS0914 16/32-BIT RISC Flash Microcontroller
| 参数名称 | 属性值 |
| SPI | 1 |
| I2C | 1 |
| HET channels | 21,40 |
| Frequency(MHz) | 100,160 |
| CPU | Arm-Cortex - R4F |
| PWM(Ch) | 8,14 |
| UART(SCI) | 1,2 |
| CAN(#) | 3,2 |
| Rating | Automotive |
| ADC | 2 x 12-Bit (24ch) |
| MibSPI | 2,3 |
| Flash (KB) | 1024 |
| GPIO | 45,64 |
| Package Group | LQFP|100,LQFP|144 |
| RAM(KB) | 128 |
| Data flash(KB) | 64 |
| Approx. price(US$) | 10.49 | 1ku |
| Operating temperature range(C) | -40 to 125 |
| SCI/LIN | 2/1,1/1 |
| TMS570LS0914 | TMX5700914PZQQ1 | TMX5700914ZWTQQ1 | TMS5700914APZQQ1 | TMX5700914APZQQ1 | TMX5700914PGEQQ1 | |
|---|---|---|---|---|---|---|
| 描述 | TMS570LS0914 16/32-BIT RISC Flash Microcontroller | 16/32-BIT RISC Flash Microcontroller 100-LQFP -40 to 125 | TMS570LS0914 16/32-BIT RISC Flash Microcontroller 337-NFBGA -40 to 125 | 16/32-BIT RISC Flash Microcontroller 100-LQFP -40 to 125 | ARM Microcontrollers - MCU Hercules MCU | ARM Microcontrollers - MCU R 595-MS5700914APGEQQ1 |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 含铅 | 含铅 | 不含铅 | - | 含铅 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | - | LQFP-100 | NFBGA-337 | LQFP-100 | - | LQFP-144 |
| Reach Compliance Code | - | compliant | unknown | compliant | compliant | unknown |
| 具有ADC | - | YES | YES | YES | - | YES |
| 位大小 | - | 32 | 32 | 32 | - | 32 |
| 最大时钟频率 | - | 80 MHz | 80 MHz | 80 MHz | - | 80 MHz |
| DAC 通道 | - | NO | NO | NO | - | NO |
| DMA 通道 | - | YES | YES | YES | - | YES |
| JESD-30 代码 | - | S-PQFP-G100 | S-PBGA-B337 | S-PQFP-G100 | - | S-PQFP-G144 |
| 长度 | - | 14 mm | 16 mm | 14 mm | - | 20 mm |
| I/O 线路数量 | - | 45 | 101 | 45 | - | 64 |
| 端子数量 | - | 100 | 337 | 100 | - | 144 |
| 片上程序ROM宽度 | - | 8 | 8 | 8 | - | 8 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
| PWM 通道 | - | YES | YES | YES | - | YES |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | LFQFP | LFBGA | LFQFP | - | LFQFP |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | - | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH |
| RAM(字节) | - | 131072 | 131072 | 131072 | - | 131072 |
| ROM(单词) | - | 1048576 | 1048576 | 1048576 | - | 1048576 |
| ROM可编程性 | - | FLASH | FLASH | FLASH | - | FLASH |
| 筛选级别 | - | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | - | 1.6 mm | 1.4 mm | 1.6 mm | - | 1.6 mm |
| 速度 | - | 100 MHz | 180 MHz | 100 MHz | - | 160 MHz |
| 最大供电电压 | - | 1.32 V | 1.32 V | 1.32 V | - | 1.32 V |
| 最小供电电压 | - | 1.14 V | 1.14 V | 1.14 V | - | 1.14 V |
| 标称供电电压 | - | 1.2 V | 1.2 V | 1.2 V | - | 1.2 V |
| 表面贴装 | - | YES | YES | YES | - | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子形式 | - | GULL WING | BALL | GULL WING | - | GULL WING |
| 端子节距 | - | 0.5 mm | 0.8 mm | 0.5 mm | - | 0.5 mm |
| 端子位置 | - | QUAD | BOTTOM | QUAD | - | QUAD |
| 宽度 | - | 14 mm | 16 mm | 14 mm | - | 20 mm |
| uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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