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TLC393: 产品描述TLC393 Dual, Micropower, LinCMOS™ Voltage Comparator; 产品类别半导体模拟混合信号IC; 文件大小2MB，共33页; 制造商Texas Instruments(德州仪器); 官网地址http://www.ti.com.cn/; 标准

敬请期待详细参数选型对比

TLC393概述

TLC393 Dual, Micropower, LinCMOS™ Voltage Comparator

TLC393规格参数

参数名称	属性值
Propagation delay time(uS)	1
Package Group	PDIP\|8,SOIC\|8,SO\|8,TSSOP\|8
Approx. price(US$)	0.40 \| 1ku
Features	N/A
Vs(Min)(V)	3
Rating	Catalog
Rail-to-rail	Out
Input bias current (+/-)(Max)(nA)	0.002
Vs(Max)(V)	16
Iq per channel(Max)(mA)	0.02
Vos (offset voltage @ 25 C)(Max)(mV)	5
Output type	Open Collector
Iq per channel(Typ)(mA)	0.011
VICR(Max)(V)	15
Number of channels(#)	2
Operating temperature range(C)	-40 to 125,-40 to 85,0 to 70
VICR(Min)(V)	0

TLC393相似产品对比

	TLC393	TLC393QDRG4	TLC393IPWG4	TLC393CPSG4	5962-9555101NXDR	5962-9555101QPA	TLC193MJGB	TLC193
描述	TLC393 Dual, Micropower, LinCMOS™ Voltage Comparator	Dual, Micropower, LinCMOS™ Voltage Comparator 8-SOIC	Dual, Micropower, LinCMOS™ Voltage Comparator 8-TSSOP -40 to 85	Analog Comparators Dual,Micropower,Lin CMOS Vltg Comparator	Dual Micropower LinCMOS™ Comparator 8-SOIC	Dual Micropower LinCMOS™ Comparator 8-CDIP -55 to 125	Dual Micropower LinCMOS™ Comparator 8-CDIP -55 to 125	TLC193 Dual Micropower LinCMOS™ Comparator
Brand Name	-	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments	-
零件包装代码	-	SOIC	SOIC	-	SOIC	DIP	DIP	-
包装说明	-	SOIC-8	TSSOP, TSSOP8,.25	-	SOP,	DIP, DIP8,.3	DIP, DIP8,.3	-
针数	-	8	8	-	8	8	8	-
Reach Compliance Code	-	compliant	compliant	-	compliant	not_compliant	not_compliant	-
ECCN代码	-	EAR99	EAR99	-	EAR99	EAR99	EAR99	-
Factory Lead Time	-	6 weeks	6 weeks	-	6 weeks	6 weeks	1 week	-
放大器类型	-	COMPARATOR	COMPARATOR	-	COMPARATOR	COMPARATOR	COMPARATOR	-
最大平均偏置电流 (IIB)	-	0.000002 µA	0.002 µA	-	0.00003 µA	0.00003 µA	0.03 µA	-
最大输入失调电压	-	10000 µV	7000 µV	-	10000 µV	10000 µV	10000 µV	-
JESD-30 代码	-	R-PDSO-G8	R-PDSO-G8	-	R-PDSO-G8	R-GDIP-T8	R-GDIP-T8	-
长度	-	4.9 mm	4.4 mm	-	4.9 mm	9.58 mm	9.58 mm	-
功能数量	-	2	2	-	2	2	2	-
端子数量	-	8	8	-	8	8	8	-
最高工作温度	-	125 °C	85 °C	-	125 °C	125 °C	125 °C	-
最低工作温度	-	-40 °C	-40 °C	-	-55 °C	-55 °C	-55 °C	-
输出类型	-	OPEN-DRAIN	OPEN-DRAIN	-	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	-
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	-
封装代码	-	SOP	TSSOP	-	SOP	DIP	DIP	-
封装形状	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
封装形式	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE	IN-LINE	IN-LINE	-
峰值回流温度（摄氏度）	-	260	260	-	260	NOT SPECIFIED	NOT SPECIFIED	-
认证状态	-	Not Qualified	Not Qualified	-	Not Qualified	Qualified	Not Qualified	-
标称响应时间	-	2500 ns	2500 ns	-	2500 ns	2500 ns	2500 ns	-
座面最大高度	-	1.75 mm	1.2 mm	-	1.75 mm	5.08 mm	5.08 mm	-
最大压摆率	-	0.02 mA	0.02 mA	-	0.04 mA	0.02 mA	0.02 mA	-
供电电压上限	-	18 V	18 V	-	18 V	18 V	18 V	-
标称供电电压 (Vsup)	-	5 V	5 V	-	5 V	5 V	5 V	-
表面贴装	-	YES	YES	-	YES	NO	NO	-
技术	-	CMOS	CMOS	-	CMOS	CMOS	CMOS	-
温度等级	-	AUTOMOTIVE	INDUSTRIAL	-	MILITARY	MILITARY	MILITARY	-
端子形式	-	GULL WING	GULL WING	-	GULL WING	THROUGH-HOLE	THROUGH-HOLE	-
端子节距	-	1.27 mm	0.65 mm	-	1.27 mm	2.54 mm	2.54 mm	-
端子位置	-	DUAL	DUAL	-	DUAL	DUAL	DUAL	-
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
宽度	-	3.9 mm	3 mm	-	3.9 mm	7.62 mm	7.62 mm	-

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