SN74ALS667 Octal D-Type Transparent Read-Back Latches With 3-State Outputs
| 参数名称 | 属性值 |
| 3-state output | Yes |
| Bits(#) | 8 |
| Technology Family | ALS |
| IOH(Max)(mA) | 2.6 |
| tpd @ nom Voltage(Max)(ns) | 20 |
| Rating | Catalog |
| IOL(Max)(mA) | 24 |
| Voltage(Nom)(V) | 5 |
| VCC(Max)(V) | 5.5 |
| ICC @ nom voltage(Max)(mA) | 79 |
| F @ nom voltage(Max)(Mhz) | 75 |
| Schmitt trigger | No |
| VCC(Min)(V) | 4.5 |
| Operating temperature range(C) | 0 to 70 |
| Package Group | SOIC|24 |
| Approx. price(US$) | 17.00 | 1ku |
| SN74ALS667 | SN74ALS667DWG4 | SN74ALS666NTE4 | SN74ALS667NTE4 | SN74ALS667DWE4 | SN74ALS666 | |
|---|---|---|---|---|---|---|
| 描述 | SN74ALS667 Octal D-Type Transparent Read-Back Latches With 3-State Outputs | Latches Octal DType TRANPNT Read Back Latches | Latches Octal DType TRANPNT Read Back Latches | Latches Octal DType TRANPNT Read Back Latches | Latches Octal DType TRANPNT Read Back Latches | SN74ALS666 Octal D-Type Transparent Read-Back Latches With 3-State Outputs |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | - | SOIC | DIP | DIP | SOIC | - |
| 包装说明 | - | SOP, SOP24,.4 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | - |
| 针数 | - | 24 | 24 | 24 | 24 | - |
| Reach Compliance Code | - | unknown | unknown | unknown | unknown | - |
| 系列 | - | ALS | ALS | ALS | ALS | - |
| JESD-30 代码 | - | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | - |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | - |
| 长度 | - | 15.4 mm | 31.64 mm | 31.64 mm | 15.4 mm | - |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 最大I（ol） | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A | - |
| 位数 | - | 8 | 8 | 8 | 8 | - |
| 功能数量 | - | 1 | 1 | 1 | 1 | - |
| 端口数量 | - | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 24 | 24 | 24 | 24 | - |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | - | INVERTED | TRUE | TRUE | INVERTED | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | SOP | DIP | DIP | SOP | - |
| 封装等效代码 | - | SOP24,.4 | DIP24,.3 | DIP24,.3 | SOP24,.4 | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | - |
| 包装方法 | - | TUBE | TUBE | TUBE | TUBE | - |
| 峰值回流温度（摄氏度） | - | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | - |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | - |
| 最大电源电流（ICC） | - | 79 mA | 73 mA | 79 mA | 79 mA | - |
| Prop。Delay @ Nom-Sup | - | 20 ns | 18 ns | 20 ns | 20 ns | - |
| 传播延迟（tpd） | - | 22 ns | 27 ns | 28 ns | 22 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 2.65 mm | 5.08 mm | 5.08 mm | 2.65 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | - | YES | NO | NO | YES | - |
| 技术 | - | TTL | TTL | CMOS | TTL | - |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - |
| 端子节距 | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm | - |
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