SN74AHC4066 Quadruple Bilateral Analog Switch
| 参数名称 | 属性值 |
| Input/output continuous current(Max)(mA) | 25 |
| VIL(Max)(V) | Vdd*.3 |
| Rating | Catalog |
| Vdd(Max)(V) | 5.5 |
| Supply current(Max)(uA) | 20 |
| CON(Typ)(pF) | 5.5 |
| Ron(Typ)(Ohms) | 21 |
| Bandwidth(MHz) | 50 |
| OFF-state leakage current(Max)(μA) | 1 |
| VIH(Min)(V) | Vdd*.7 |
| ON-state leakage current(Max)(μA) | 1 |
| Number of channels(#) | 4 |
| Supply range(Max) | 5.5 |
| Operating temperature range(C) | -40 to 85 |
| Vdd(Min)(V) | 2 |
| Approx. price(US$) | 0.14 | 1ku |
| ESD CDM(kV) | 1 |
| Package Group | PDIP|14,SOIC|14,SO|14,SSOP|14,TSSOP|14,TVSOP|14,VQFN|14 |
| ESD HBM(kV) | 2 |
| Power supply type | Single |
| Ron(Max)(Ohms) | 225 |
| SN74AHC4066 | SN74AHC4066PWG4 | SN74AHC4066PWRG4 | SN74AHC4066DGVRG4 | SN74AHC4066DRG4 | |
|---|---|---|---|---|---|
| 描述 | SN74AHC4066 Quadruple Bilateral Analog Switch | Analog Switch ICs Quad Bilateral Analog Switch | Analog Switch ICs Quad Bilateral Analog Switch | Analog Switch ICs Quad Bilateral Analog Switch | Analog Switch ICs Quad Bilateral Analog Switch |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | TSSOP | TSSOP | SOIC | SOIC |
| 包装说明 | - | TSSOP, TSSOP14,.25 | TSSOP, TSSOP14,.25 | TSSOP, TSSOP14,.25,16 | SOP, SOP14,.25 |
| 针数 | - | 14 | 14 | 14 | 14 |
| Reach Compliance Code | - | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | - | SPST | SPST | SPST | SPST |
| JESD-30 代码 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 |
| 长度 | - | 5 mm | 5 mm | 4.4 mm | 8.65 mm |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 正常位置 | - | NO | NO | NO | NO |
| 信道数量 | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | 4 | 4 | 4 | 4 |
| 端子数量 | - | 14 | 14 | 14 | 14 |
| 标称断态隔离度 | - | 40 dB | 40 dB | 40 dB | 40 dB |
| 通态电阻匹配规范 | - | 6 Ω | 6 Ω | 6 Ω | 6 Ω |
| 最大通态电阻 (Ron) | - | 180 Ω | 180 Ω | 180 Ω | 180 Ω |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP | TSSOP | SOP |
| 封装等效代码 | - | TSSOP14,.25 | TSSOP14,.25 | TSSOP14,.25,16 | SOP14,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.75 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 最长断开时间 | - | 25 ns | 25 ns | 25 ns | 25 ns |
| 最长接通时间 | - | 25 ns | 25 ns | 25 ns | 25 ns |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 0.65 mm | 0.65 mm | 0.4 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 4.4 mm | 4.4 mm | 3.6 mm | 3.9 mm |
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