CD4016B CMOS Quad Bilateral Switch
| 参数名称 | 属性值 |
| Supply current(Max)(uA) | 5 |
| Vdd(Min)(V) | 3 |
| Power supply type | Single,Dual |
| Bandwidth(MHz) | 40 |
| VIL(Max)(V) | 0.9 |
| Rating | Catalog |
| Vss(Min)(V) | -10 |
| Vss(Max)(V) | 0 |
| ON-state leakage current(Max)(μA) | 0.1 |
| VIH(Min)(V) | Vdd*.7 |
| Package Group | PDIP|14,SOIC|14,SO|14,TSSOP|14 |
| Supply current(Typ)(uA) | 0.01 |
| Number of channels(#) | 4 |
| Supply range(Max) | 18 |
| Ron(Typ)(Ohms) | 180 |
| Operating temperature range(C) | -55 to 125 |
| Features | Break-before-make |
| Vdd(Max)(V) | 18 |
| Input/output continuous current(Max)(mA) | 10 |
| Ron(Max)(Ohms) | 860 |
| Approx. price(US$) | 0.12 | 1ku |
| CD4016B | 5962-9064001CA | CD4016BF | CD4016BF3A | CD4016B-MIL | |
|---|---|---|---|---|---|
| 描述 | CD4016B CMOS Quad Bilateral Switch | CMOS Quad Bilateral Switch 14-CDIP -55 to 125 | CMOS Quad Bilateral Switch 14-CDIP -55 to 125 | CMOS Quad Bilateral Switch 14-CDIP -55 to 125 | CD4016B-MIL CMOS Quad Bilateral Switch |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 零件包装代码 | - | DIP | DIP | DIP | - |
| 包装说明 | - | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - |
| 针数 | - | 14 | 14 | 14 | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | - | 1 week | 6 weeks | 1 week | - |
| 模拟集成电路 - 其他类型 | - | SPST | SPST | SPST | - |
| 标称带宽 | - | 40 MHz | 40 MHz | 40 MHz | - |
| 最大输入电压 | - | 0.9 V | 0.9 V | 0.9 V | - |
| JESD-30 代码 | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - |
| 长度 | - | 19.56 mm | 19.56 mm | 19.56 mm | - |
| 正常位置 | - | NO | NO | NO | - |
| 信道数量 | - | 4 | 1 | 4 | - |
| 功能数量 | - | 4 | 4 | 4 | - |
| 端子数量 | - | 14 | 14 | 14 | - |
| 标称断态隔离度 | - | 50 dB | 50 dB | 50 dB | - |
| 通态电阻匹配规范 | - | 10 Ω | 10 Ω | 10 Ω | - |
| 最大通态电阻 (Ron) | - | 2000 Ω | 2000 Ω | 2000 Ω | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | - |
| 输出 | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | - | DIP | DIP | DIP | - |
| 封装等效代码 | - | DIP14,.3 | DIP14,.3 | DIP14,.3 | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | - | 3/18 V | 3/18 V | 5/15 V | - |
| 认证状态 | - | Qualified | Not Qualified | Not Qualified | - |
| 筛选级别 | - | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B | - |
| 座面最大高度 | - | 4.57 mm | 5.08 mm | 4.57 mm | - |
| 最大供电电流 (Isup) | - | 0.005 mA | 0.005 mA | 0.005 mA | - |
| 最大供电电压 (Vsup) | - | 18 V | 18 V | 18 V | - |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 10 V | - |
| 表面贴装 | - | NO | NO | NO | - |
| 最长接通时间 | - | 40 ns | 40 ns | 40 ns | - |
| 切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - |
| 技术 | - | CMOS | CMOS | CMOS | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 6.67 mm | 7.62 mm | 6.67 mm | - |
| Base Number Matches | - | 1 | 1 | 1 | - |
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