CD4013B CMOS Dual D-Type Flip Flop
| 参数名称 | 属性值 |
| 3-state output | No |
| VCC(Max)(V) | 18 |
| Voltage(Nom)(V) | 10 |
| Rating | Catalog |
| F @ nom voltage(Max)(Mhz) | 8 |
| VCC(Min)(V) | 3 |
| Approx. price(US$) | 0.11 | 1ku |
| tpd @ nom Voltage(Max)(ns) | 130 |
| Package Group | PDIP|14,SOIC|14,SO|14,TSSOP|14 |
| ICC @ nom voltage(Max)(mA) | 0.06 |
| IOH(Max)(mA) | -1.5 |
| Operating temperature range(C) | -55 to 125 |
| IOL(Max)(mA) | 1.5 |
| Schmitt trigger | No |
| Bits(#) | 2 |
| Technology Family | CD4000 |
| CD4013B | CD4013BF | CD4013BF3A | JM38510/05151BCA | M38510/05151BCA | CD4013B-MIL | |
|---|---|---|---|---|---|---|
| 描述 | CD4013B CMOS Dual D-Type Flip Flop | CMOS Dual D-Type Flip Flop 14-CDIP -55 to 125 | CMOS Dual D-Type Flip Flop 14-CDIP -55 to 125 | CMOS Dual D-Type Flip Flop 14-CDIP -55 to 125 | CMOS Dual D-Type Flip Flop 14-CDIP -55 to 125 | CD4013B-MIL CMOS Dual D-Type Flip Flop |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 零件包装代码 | - | DIP | DIP | DIP | DIP | - |
| 包装说明 | - | DIP-14 | DIP, DIP14,.3 | DIP, | DIP, DIP14,.3 | - |
| 针数 | - | 14 | 14 | 14 | 14 | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | - |
| 系列 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | - |
| JESD-30 代码 | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - |
| 长度 | - | 19.305 mm | 19.56 mm | 19.56 mm | 19.56 mm | - |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - |
| 最大I（ol） | - | 0.0068 A | 0.0068 A | 0.0068 A | 0.0068 A | - |
| 位数 | - | 1 | 1 | 1 | 1 | - |
| 功能数量 | - | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 14 | 14 | 14 | 14 | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出极性 | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | - | DIP | DIP | DIP | DIP | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
| 包装方法 | - | TUBE | TUBE | TUBE | TUBE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 最大电源电流（ICC） | - | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | - |
| Prop。Delay @ Nom-Sup | - | 300 ns | 300 ns | 300 ns | 825 ns | - |
| 传播延迟（tpd） | - | 300 ns | 300 ns | 300 ns | 825 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Qualified | - |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - |
| 最大供电电压 (Vsup) | - | 18 V | 18 V | 18 V | 18 V | - |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 10 V | - |
| 表面贴装 | - | NO | NO | NO | NO | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - |
| 宽度 | - | 7.62 mm | 6.67 mm | 6.67 mm | 6.67 mm | - |
| 最小 fmax | - | 12 MHz | 12 MHz | 12 MHz | 1 MHz | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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