TLC556M Low-Power Dual LinCMOS
| 参数名称 | 属性值 |
| Frequency(Max)(MHz) | 2.1 |
| Rating | Military |
| Iq(Typ)(uA) | 130 |
| Operating temperature range(C) | -55 to 125 |
| VCC(Min)(V) | 2 |
| Package Group | CDIP|14,LCCC|20 |
| VCC(Max)(V) | 15 |
| TLC556M | 5962-89503022A | 5962-8950302CA | TLC556MFKB | TLC556MJ | TLC556MJB | TLC556 | |
|---|---|---|---|---|---|---|---|
| 描述 | TLC556M Low-Power Dual LinCMOS |
Low-Power Dual LinCMOS |
Low-Power Dual LinCMOS |
Low-Power Dual LinCMOS |
Low-Power Dual LinCMOS |
Low-Power Dual LinCMOS |
TLC556 Dual LinCMOS™ Timer |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 零件包装代码 | - | QLCC | DIP | QLCC | DIP | DIP | - |
| 包装说明 | - | LCC-20 | DIP-14 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DIP, DIP14,.3 | - |
| 针数 | - | 20 | 14 | 20 | 14 | 14 | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | - | 6 weeks | 1 week | 6 weeks | 6 weeks | - | - |
| 其他特性 | - | IT CAN ALSO OPERATE AT 15V NOMINAL | IT CAN ALSO OPERATE AT 15V NOMINAL | IT CAN ALSO OPERATE AT 15V NOMINAL | IT CAN ALSO OPERATE AT 15V NOMINAL | IT CAN ALSO OPERATE AT 15V NOMINAL | - |
| 模拟集成电路 - 其他类型 | - | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR | - |
| JESD-30 代码 | - | S-CQCC-N20 | R-GDIP-T14 | S-CQCC-N20 | R-GDIP-T14 | R-GDIP-T14 | - |
| 长度 | - | 8.89 mm | 19.56 mm | 8.89 mm | 19.56 mm | 19.56 mm | - |
| 功能数量 | - | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 20 | 14 | 20 | 14 | 14 | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 最大输出频率 | - | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | - |
| 封装主体材料 | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | - | QCCN | DIP | QCCN | DIP | DIP | - |
| 封装等效代码 | - | LCC20,.35SQ | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | DIP14,.3 | - |
| 封装形状 | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | - | 5/15 V | 5/15 V | 5/18 V | 5/18 V | 5/18 V | - |
| 认证状态 | - | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 筛选级别 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
| 座面最大高度 | - | 1.83 mm | 4.57 mm | 2.03 mm | 5.08 mm | 5.08 mm | - |
| 最大供电电流 (Isup) | - | 1.4 mA | 1.4 mA | 1.4 mA | 1.4 mA | 1.4 mA | - |
| 最大供电电压 (Vsup) | - | 15 V | 15 V | 15 V | 15 V | 15 V | - |
| 最小供电电压 (Vsup) | - | 2 V | 2 V | 2 V | 2 V | 2 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | - | YES | NO | YES | NO | NO | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | - | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | - | QUAD | DUAL | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 8.89 mm | 6.67 mm | 8.89 mm | 7.62 mm | 7.62 mm | - |
| Base Number Matches | - | 1 | 1 | - | 1 | 1 | - |
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