Scan Test Devices With Octal Buffers 24-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| Factory Lead Time | 6 weeks |
| 其他特性 | SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN |
| 控制类型 | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-GDIP-T24 |
| 长度 | 32 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BOUNDARY SCAN BUS DRIVER |
| 最大I（ol） | 0.064 A |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 52 mA |
| Prop。Delay @ Nom-Sup | 9 ns |
| 传播延迟（tpd） | 10 ns |
| 认证状态 | Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 宽度 | 6.92 mm |
| Base Number Matches | 1 |
| 5962-9174601QLA | SN74BCT8240ADWG4 | 5962-9174601Q3A | SNJ54BCT8240AFK | SNJ54BCT8240AJT | SN74BCT8240A | SN54BCT8240A | |
|---|---|---|---|---|---|---|---|
| 描述 | Scan Test Devices With Octal Buffers 24-CDIP -55 to 125 | Specialty Function Logic IEEE Std 1149.1 Bndry Sacn Tst Devic | Scan Test Devices With Octal Buffers 28-LCCC -55 to 125 | Scan Test Devices With Octal Buffers 28-LCCC -55 to 125 | Scan Test Devices With Octal Buffers 24-CDIP -55 to 125 | SN74BCT8240A IEEE Std 1149.1 (JTAG) Boundary-Scan Test Device With Octal Inverting Buffers | SN54BCT8240A Scan Test Devices With Octal Buffers |
| Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | DIP | SOIC | QLCC | QLCC | DIP | - | - |
| 包装说明 | DIP, DIP24,.3 | SOP, SOP24,.4 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | - | - |
| 针数 | 24 | 24 | 28 | 28 | 24 | - | - |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant | not_compliant | - | - |
| Factory Lead Time | 6 weeks | - | 26 weeks | 26 weeks | 6 weeks | - | - |
| 其他特性 | SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN | SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN | SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN | SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN | SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN | - | - |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | - |
| 计数方向 | UNIDIRECTIONAL | - | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | - |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | - | - |
| JESD-30 代码 | R-GDIP-T24 | R-PDSO-G24 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 | - | - |
| 长度 | 32 mm | 15.4 mm | 11.43 mm | 11.43 mm | 32.005 mm | - | - |
| 逻辑集成电路类型 | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | BOUNDARY SCAN BUS DRIVER | - | - |
| 最大I（ol） | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | - | - |
| 位数 | 4 | 4 | 4 | 4 | 4 | - | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端子数量 | 24 | 24 | 28 | 28 | 24 | - | - |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | - | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | DIP | SOP | QCCN | QCCN | DIP | - | - |
| 封装等效代码 | DIP24,.3 | SOP24,.4 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | - | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 最大电源电流（ICC） | 52 mA | 52 mA | 52 mA | 52 mA | 52 mA | - | - |
| Prop。Delay @ Nom-Sup | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | - | - |
| 传播延迟（tpd） | 10 ns | 9 ns | 10 ns | 9 ns | 9 ns | - | - |
| 认证状态 | Qualified | Not Qualified | Qualified | Not Qualified | Not Qualified | - | - |
| 筛选级别 | MIL-PRF-38535 Class Q | - | MIL-PRF-38535 Class Q | MIL-PRF-38535 | MIL-PRF-38535 | - | - |
| 座面最大高度 | 5.08 mm | 2.65 mm | 2.03 mm | 2.03 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | NO | YES | YES | YES | NO | - | - |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - | - |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | THROUGH-HOLE | GULL WING | NO LEAD | NO LEAD | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 翻译 | N/A | - | N/A | N/A | N/A | - | - |
| 宽度 | 6.92 mm | 7.5 mm | 11.43 mm | 11.43 mm | 7.62 mm | - | - |
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