Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 控制类型 | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T20 |
| 长度 | 24.195 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 0.08 mA |
| Prop。Delay @ Nom-Sup | 9.5 ns |
| 传播延迟（tpd） | 9.5 ns |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8775901MRA | 5962-8775901M2A | 5962-8775901MSA | SNJ54ACT240FK | SNJ54ACT240J | SNJ54ACT240W | SN74ACT240 | SN54ACT240 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125 | Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125 | Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125 | Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125 | Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125 | Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125 | SN74ACT240 Octal Buffers/Drivers With 3-State Outputs | SN54ACT240 Octal Buffers/Drivers With 3-State Outputs |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 零件包装代码 | DIP | QLCC | DFP | QLCC | DIP | DFP | - | - |
| 包装说明 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DFP, FL20,.3 | - | - |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - |
| Factory Lead Time | 6 weeks | 1 week | 16 weeks | 6 weeks | 1 week | 16 weeks | - | - |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | - |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | - |
| 系列 | ACT | ACT | ACT | ACT | ACT | ACT | - | - |
| JESD-30 代码 | R-GDIP-T20 | S-CQCC-N20 | R-GDFP-F20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 | - | - |
| 长度 | 24.195 mm | 8.89 mm | 13.09 mm | 8.89 mm | 24.195 mm | 13.09 mm | - | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | - |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | - | - |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | - | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | - |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | - | - |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - |
| 封装代码 | DIP | QCCN | DFP | QCCN | DIP | DFP | - | - |
| 封装等效代码 | DIP20,.3 | LCC20,.35SQ | FL20,.3 | LCC20,.35SQ | DIP20,.3 | FL20,.3 | - | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | - | - |
| 包装方法 | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 最大电源电流（ICC） | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.04 mA | 0.08 mA | - | - |
| Prop。Delay @ Nom-Sup | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | - | - |
| 传播延迟（tpd） | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | - | - |
| 认证状态 | Qualified | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | - | - |
| 座面最大高度 | 5.08 mm | 2.03 mm | 2.45 mm | 2.03 mm | 5.08 mm | 2.45 mm | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - |
| 表面贴装 | NO | YES | YES | YES | NO | YES | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE | FLAT | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | - |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 7.62 mm | 8.89 mm | 6.92 mm | 8.89 mm | 7.62 mm | 6.92 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | - | - |
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