
Highly Integrated Digital Controller for Isolated Power 64-VQFN -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | VQFN-64 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991A2 |
| Factory Lead Time | 6 weeks |
| Is Samacsys | N |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PQCC-N64 |
| JESD-609代码 | e4 |
| 长度 | 9 mm |
| 湿度敏感等级 | 2 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | 0.88 mm |
| 最大供电电流 (Isup) | 105 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 9 mm |
| Base Number Matches | 1 |
| UCD3138064ARGCT | UCD3138064ARGCR | UCD3138064A | |
|---|---|---|---|
| 描述 | Highly Integrated Digital Controller for Isolated Power 64-VQFN -40 to 125 | Highly Integrated Digital Controller for Isolated Power 64-VQFN -40 to 125 | UCD3138064A Highly Integrated Digital Controller for Isolated Power |
| Brand Name | Texas Instruments | Texas Instruments | - |
| 是否无铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 包装说明 | VQFN-64 | HVQCCN, | - |
| Reach Compliance Code | compliant | compliant | - |
| Factory Lead Time | 6 weeks | 16 weeks | - |
| 可调阈值 | NO | NO | - |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - |
| JESD-30 代码 | S-PQCC-N64 | S-PQCC-N64 | - |
| JESD-609代码 | e4 | e4 | - |
| 长度 | 9 mm | 9 mm | - |
| 湿度敏感等级 | 2 | 2 | - |
| 信道数量 | 1 | 1 | - |
| 功能数量 | 1 | 1 | - |
| 端子数量 | 64 | 64 | - |
| 最高工作温度 | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | HVQCCN | HVQCCN | - |
| 封装形状 | SQUARE | SQUARE | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 座面最大高度 | 0.88 mm | 1 mm | - |
| 最大供电电流 (Isup) | 105 mA | 105 mA | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 3 V | 3 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | YES | - |
| 技术 | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | NO LEAD | NO LEAD | - |
| 端子节距 | 0.5 mm | 0.5 mm | - |
| 端子位置 | QUAD | QUAD | - |
| 宽度 | 9 mm | 9 mm | - |
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