Single cell Pack/System-side CEDV Battery Fuel (Gas) Gauge w/Pre-programmed Chemistry Profiles 9-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | VFBGA, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 12 weeks |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-XBGA-B9 |
| JESD-609代码 | e1 |
| 长度 | 1.75 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 0.625 mm |
| 最大供电电压 (Vsup) | 4.5 V |
| 最小供电电压 (Vsup) | 2.45 V |
| 标称供电电压 (Vsup) | 3.6 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 宽度 | 1.75 mm |
| Base Number Matches | 1 |
| BQ27220YZFR | BQ27220YZFT | BQ27220 | |
|---|---|---|---|
| 描述 | Single cell Pack/System-side CEDV Battery Fuel (Gas) Gauge w/Pre-programmed Chemistry Profiles 9-DSBGA -40 to 85 | Single cell Pack/System-side CEDV Battery Fuel (Gas) Gauge w/Pre-programmed Chemistry Profiles 9-DSBGA -40 to 85 | BQ27220 Single cell Pack/System-side CEDV Battery Fuel (Gas) Gauge w/Pre-programmed Chemistry Profiles |
| Brand Name | Texas Instruments | Texas Instruments | - |
| 是否无铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | - |
| 包装说明 | VFBGA, | VFBGA, | - |
| Reach Compliance Code | compliant | compliant | - |
| Factory Lead Time | 12 weeks | 6 weeks | - |
| 可调阈值 | NO | NO | - |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - |
| JESD-30 代码 | S-XBGA-B9 | S-XBGA-B9 | - |
| JESD-609代码 | e1 | e1 | - |
| 长度 | 1.75 mm | 1.75 mm | - |
| 湿度敏感等级 | 1 | 1 | - |
| 信道数量 | 1 | 1 | - |
| 功能数量 | 1 | 1 | - |
| 端子数量 | 9 | 9 | - |
| 最高工作温度 | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | VFBGA | VFBGA | - |
| 封装形状 | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
| 座面最大高度 | 0.625 mm | 0.625 mm | - |
| 最大供电电压 (Vsup) | 4.5 V | 4.5 V | - |
| 最小供电电压 (Vsup) | 2.45 V | 2.45 V | - |
| 标称供电电压 (Vsup) | 3.6 V | 3.6 V | - |
| 表面贴装 | YES | YES | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
| 端子形式 | BALL | BALL | - |
| 端子节距 | 0.5 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | BOTTOM | - |
| 宽度 | 1.75 mm | 1.75 mm | - |
| Base Number Matches | 1 | 1 | - |
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