Bus Transceivers 10B Bus Transceiver
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | GREEN, PLASTIC, TVSOP-24 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP24,.25,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 6.4 ns |
| 传播延迟（tpd） | 6.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| SN74LVC861ADGVRG4 | SN74LVC861ADBRG4 | SN74LVC861APWRG4 | SN74LVC861APWG4 | SN74LVC861ADWG4 | SN74LVC861APWTG4 | SN74LVC861A | |
|---|---|---|---|---|---|---|---|
| 描述 | Bus Transceivers 10B Bus Transceiver | Bus Transceivers 10B Bus Transceiver | Bus Transceivers 10B Bus Transceiver | Bus Transceivers 10B Bus Transceiver | Bus Transceivers 10B Bus Transceiver | Bus Transceivers 10B Bus Transceiver | SN74LVC861A 10-Bit Bus Transceiver With 3-State Outputs |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | SOIC | SSOP | TSSOP | TSSOP | SOIC | TSSOP | - |
| 包装说明 | GREEN, PLASTIC, TVSOP-24 | SSOP, SSOP24,.3 | GREEN, PLASTIC, TSSOP-24 | GREEN, PLASTIC, TSSOP-24 | SOP, SOP24,.4 | TSSOP, TSSOP24,.25 | - |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | - |
| Is Samacsys | N | N | N | N | N | N | - |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | - |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | - |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | - |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 5 mm | 8.2 mm | 7.8 mm | 7.8 mm | 15.4 mm | 7.8 mm | - |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | - |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | SSOP | TSSOP | TSSOP | SOP | TSSOP | - |
| 封装等效代码 | TSSOP24,.25,16 | SSOP24,.3 | TSSOP24,.25 | TSSOP24,.25 | SOP24,.4 | TSSOP24,.25 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TUBE | TUBE | TAPE AND REEL | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| Prop。Delay @ Nom-Sup | 6.4 ns | 6.4 ns | 6.4 ns | 6.4 ns | 6.4 ns | 6.4 ns | - |
| 传播延迟（tpd） | 6.8 ns | 6.8 ns | 6.8 ns | 6.8 ns | 6.8 ns | 6.8 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.2 mm | 2 mm | 1.2 mm | 1.2 mm | 2.65 mm | 1.2 mm | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.4 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 翻译 | N/A | N/A | N/A | N/A | N/A | N/A | - |
| 宽度 | 4.4 mm | 5.3 mm | 4.4 mm | 4.4 mm | 7.5 mm | 4.4 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
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