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54F11/BCA

产品描述IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, Gate
产品类别逻辑    逻辑   
文件大小82KB,共3页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

54F11/BCA概述

IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, Gate

54F11/BCA规格参数

参数名称属性值
包装说明DIP,
Reach Compliance Codeunknown
系列F/FAST
JESD-30 代码R-GDIP-T14
负载电容(CL)50 pF
逻辑集成电路类型AND GATE
功能数量3
输入次数3
端子数量14
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
最大电源电流(ICC)9.7 mA
传播延迟(tpd)7.5 ns
认证状态Not Qualified
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术TTL
温度等级MILITARY
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度7.62 mm
Base Number Matches1

54F11/BCA相似产品对比

54F11/BCA 54F10/B2A N54F11/BDA N54F11/B2A 54F11/BDA 54F11/B2A N54F10/B2A 54F10/BCA 54F10/BDA N54F10/BDA
描述 IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDIP14, Gate IC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, Gate IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, CERAMIC, DFP-14, Gate IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CQCC20, CERAMIC, LLCC-20, Gate IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CDFP14, Gate IC F/FAST SERIES, TRIPLE 3-INPUT AND GATE, CQCC20, Gate IC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LLCC-20, Gate IC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, Gate IC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, Gate IC F/FAST SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14, Gate
包装说明 DIP, QCCN, DFP, QCCN, DFP, QCCN, QCCN, DIP, DFP, DFP,
Reach Compliance Code unknown unknow unknown unknown unknown unknown unknown unknown unknown unknown
系列 F/FAST F/FAST F/FAST F/FAST F/FAST F/FAST F/FAST F/FAST F/FAST F/FAST
JESD-30 代码 R-GDIP-T14 S-CQCC-N20 R-CDFP-F14 S-CQCC-N20 R-CDFP-F14 S-CQCC-N20 S-CQCC-N20 R-GDIP-T14 R-CDFP-F14 R-CDFP-F14
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 AND GATE NAND GATE AND GATE AND GATE AND GATE AND GATE NAND GATE NAND GATE NAND GATE NAND GATE
功能数量 3 3 3 3 3 3 3 3 3 3
输入次数 3 3 3 3 3 3 3 3 3 3
端子数量 14 20 14 20 14 20 20 14 14 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP QCCN DFP QCCN DFP QCCN QCCN DIP DFP DFP
封装形状 RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE CHIP CARRIER FLATPACK CHIP CARRIER FLATPACK CHIP CARRIER CHIP CARRIER IN-LINE FLATPACK FLATPACK
最大电源电流(ICC) 9.7 mA 7.7 mA 9.7 mA 9.7 mA 9.7 mA 9.7 mA 7.7 mA 7.7 mA 7.7 mA 7.7 mA
传播延迟(tpd) 7.5 ns 6.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES YES YES YES NO YES YES
技术 TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE NO LEAD FLAT NO LEAD FLAT NO LEAD NO LEAD THROUGH-HOLE FLAT FLAT
端子位置 DUAL QUAD DUAL QUAD DUAL QUAD QUAD DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1 1 1 1
座面最大高度 5.08 mm - 2.159 mm 1.905 mm - - 1.905 mm 5.08 mm - 2.159 mm
端子节距 2.54 mm - 1.27 mm 1.27 mm - - 1.27 mm 2.54 mm - 1.27 mm
宽度 7.62 mm - 6.2865 mm 8.89 mm - - 8.89 mm 7.62 mm - 6.2865 mm

 
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