Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-CDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 30.48 mm |
| 低功率模式 | NO |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 4.953 mm |
| 最大压摆率 | 15 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 |
| 5962-9051501LA | 5962-90515013C | L29C818CC25 | L29C818CMB30 | L29C818CM30 | L29C818CM24 | L29C818CC15 | L29C818CMB24 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24 | Pipeline Register, 8-Bit, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 |
| 零件包装代码 | DIP | QLCC | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP24,.3 | QCCN, | DIP, DIP24,.3 | 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, DIP-24 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| 针数 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ | ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-CDIP-T24 | S-CQCC-N28 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
| JESD-609代码 | e0 | e4 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 30.48 mm | 11.43 mm | 30.48 mm | 30.48 mm | 30.48 mm | 30.48 mm | 30.48 mm | 30.48 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
| 端子数量 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | - | -55 °C |
| 输出数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.953 mm | 2.54 mm | 4.953 mm | 4.953 mm | 4.953 mm | 4.953 mm | 4.953 mm | 4.953 mm |
| 最大压摆率 | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | TIN LEAD | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C |
| 封装等效代码 | DIP24,.3 | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
| 湿度敏感等级 | - | - | 3 | 3 | 3 | 3 | 3 | 3 |
| 峰值回流温度（摄氏度） | - | - | 225 | 225 | 225 | 225 | 225 | 225 |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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